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From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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New Senior Director of Business Development Joins Ventec U.S. Team
October 24, 2022 | Ventec International GroupEstimated reading time: 1 minute

Ventec International Group Co., Ltd. announces the appointment of Paul Cooke as Senior Director of Business Development. With a holistic focus across the entire US region, Paul will further develop Ventec’s customer base in all key industry segments, including the core automotive, military, and aerospace sectors. Driven by the growing demand for Ventec’s products, as Sr. Director Business Development, Paul will also expand our US team with experienced individuals who provide exceptional customer solutions.
Paul comes to Ventec with 30 years of combined sales and engineering experience as a leading field application engineer in the PCB and electronics industries. An expert in both client and internal team relations, he has a comprehensive history in developing customer-led solutions, as well as a strong focus on training and industry education. Paul is a leader with several PCB standards organizations, including IPC, HDPUG and SMTA.
Chris Hanson, Global Head IMS Technology at Ventec comments: “Paul has extensive experience within the aerospace and military markets among others, and we’re enthusiastic to have him on board to grow our North American and Canadian client base.”
- The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrates by Didier Mauve and Ian Mayoh
- The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Volume 2, by Didier Mauve and Robert Art
- The Solutions Guide to... Thermal Management
- Roundtable Discussion: Use of IMS Thermal Materials in Multilayer Stackups for Power Applications, with Chris Hanson and Denis McCarthy of Ventec, Rax Ribadia of Excello Circuits, and Pete Starkey, I-Connect007 technical editor
- You can also view other titles in our full I-007eBooks library.
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