-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Indium Corporation Announces New Jetting Solder Paste
November 10, 2022 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation has announced a new jetting solder paste in its line of PicoShot products. PicoShot WS-5M is designed for customers needing an SnPb solder paste for their Mycronic MY-series jet printers.
PicoShot WS-5M is a water-soluble, halogen-free paste developed as a result of a close, collaborative relationship with Mycronic for their MY 600/700 jetting systems. This product has been beta-tested at customer sites, showing proven performance on customer lines.
PicoShot WS-5M has been extensively tested to provide exceptional jetting performance. It delivers:
- Smallest dot volume among pastes in its class: 6.5nl/dot, 350µm diameter
- Precision deposit (x,y targeting)
- Long usage (syringe life) >8 hours
- Minimal statellites
PicoShot WS-5M is a water-soluble, halogen-free solder paste approved after joint Indium/Mycronic technical development with Mycronic’s MY 600/700 jetting systems. PicoShot can be used in applications, such as jetting into cavities and uneven/warped substrates, high-mix/low-volume stencil replacement, CSP/microBGA solder attach, military and aerospace jetting applications, system-in-package (SiP), camera module assembly where an overmolding step is required, and shield-attach and secondary processing.
Utilizing a Type 5 solder powder and an SnPb alloy, this material is inherently chemically compatible with Indium Corporation’s Indium6.6HF-HD Solder Paste. PicoShot® WS-5M’s unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.
PicoShot WS-5M jetting solder paste is the second material to come out of Indium Corporation’s new partnership with Mycronic, a global leader in dispensing and jet printing equipment.
Suggested Items
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.