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FKN Systek Singulates Thin V-scored Panels with Close Component Spacing
November 22, 2022 | FKN SystekEstimated reading time: Less than a minute

Singulating .032” pre-scored PCBs can be problematic on standard depanelizers because the boards tend to flex when placed between cutting blades. Due to the symmetrical design of the blades and the extra stiffness given to the circular blade by using two bearings, this problem is largely eliminated when using the K7000 for separating thin PCB panels.
The 12” (304 mm) long linear blade has a .030" (.762 mm) thin symmetrical cutting edge designed particularly for PCBs with closely spaced components. The circular blade is 3.8" (71 mm) in diameter and has the same cutting edge profile as the linear blade. -- .030" (.762 mm) This blade is mounted on a shaft with the center line of the cutting blade passing directly through the middle of the support bearings.
The operator places the score-line on the linear blade and pulls the circular blade carriage across the upper score-line to safely singulate a panel. Weighing in at under 20 lbs and with a footprint of 21” wide and 13” deep the K7000 is easily transportable.
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Rachael Temple - AlltematedSuggested Items
SCHMID Ships First InfinityLine P+ Panel-Level Plating System
10/08/2025 | SCHMID GroupSCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announced the shipment of its first InfinityLine P+ system – a newly developed panel-level plating equipment with integrated photoresist stripping.
Cadence Unveils AI-Driven ROCS X AI-Enabled Molecular Search, Unlocking Multi-trillion Molecule Virtual Screening
09/29/2025 | Cadence Design SystemsCadence Molecular Sciences (OpenEye), a business unit of Cadence, announced at miniCUP Boston, the launch of ROCS X, an AI-enabled virtual-- screening solution that allows scientists to conduct 3D searches of trillions of drug-like molecules.
SCHMID Advances Next-Gen Advanced Packaging with New InfinityLine and Glass Core Substrate Solutions
09/29/2025 | SCHMID GroupSCHMID Group, a leading global provider of equipment and solutions for the electronics industry, announces a major expansion of its product portfolio to meet the surging demand for two types of products: Advanced packaging substrates and high-performance server boards, in the era of Artificial Intelligence (AI).
Understanding Signal Integrity, the Foundation of High-Speed Digital Design
09/25/2025 | Stephen V. Chavez, Siemens EDASignal integrity has become a critical factor in ensuring reliable performance in high-speed digital systems. As data rates continue to increase, engineers must understand the fundamental principles that govern how signals propagate through transmission lines and how to mitigate common issues that can degrade signal quality.
New Podcast Episode Drop: Optimize the Interconnect—It’s a Wrap!
09/29/2025 | I-Connect007The final episode of the On the Line with… Optimize the Interconnect podcast series ties together insights from across the program, underscoring the growing importance of unified solutions for high-volume HDI PCB manufacturing. Final guest Kuldip Johal, Chief Technology Officer and Vice President of Business Development, emphasized that manufacturers must balance yield, reliability, and scalability as interconnect density and complexity continue to increase.