-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
TRI's New Multi-Camera 3D AOI at the IPC APEX EXPO 2023
November 24, 2022 | TRIEstimated reading time: 1 minute
Test Research, Inc. (TRI) will join the IPC APEX EXPO 2023 held at San Diego Convention Center on January 24-26, 2023. Visit TRI at booth #2115 to experience the latest test and inspection innovations for the PCBA Industry.
TRI will unveil the newly released multiple-camera 3D AOI, TR7500QE Plus, which includes a high-speed top camera and four side-view cameras. The side view cameras allow the platform to inspect inner layer bridges, hidden lifted leads and other out-of-sight defects.
Additionally, visitors can experience the AI-powered 3D AOI, TR7700Q SII, with improved image quality at an industry-leading speed of up to 57 cm2/sec and unprecedented 1?m high-resolution inspection capability. The TR7700Q SII can deploy multiple 3D technologies to satisfy industry demands and enable virtually zero-escapes Inspection.
Furthermore, TRI plans to showcase the world-class 3D CT AXI for large boards TR7600F3D SII and TR7600LL SIII, and the award-winning series 3D SPI TR7007QI Plus. TRI's multi-core ICT TR5001Q SII INLINE will also be featured during the exhibition.
Discover why the leading EMS companies choose TRI as their Test and Inspection Partner. Visit us at IPC APEX EXPO 2023 booth #2115 for a personal demonstration of TRI's industry-leading One Stop Solution for PCB Assembly Testing and Inspection.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/03/2024 | Nolan Johnson, I-Connect007This week’s most important news is strategic—and telling. When one puts together the IPC industry reports, we simply have to include the recent conversation with Shawn DuBravac and Tom Kastner. On the design side, check out the latest “On The Line With…” podcast featuring Brad Griffin from Cadence Design Systems, discussing SI and PI in the realm of intelligent system design.
IMI Welcomes New CEO
05/03/2024 | IMIIntegrated Micro-Electronics, Inc. (IMI),The IMI Board of Directors announced, in a disclosure dated April 25, 2024, the appointment of Louis Sylvester Hughes, Chief Executive Officer (CEO).
Gstar Announced the Strategic Move: Groundbreaking of Silicon Wafer Factory Construction in Indonesia
05/03/2024 | PRNewswireRecently, Gstar held a groundbreaking ceremony for its silicon rod and silicon wafer factory, marking the beginning of the rapid construction phase.
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
05/01/2024 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges.
On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers
05/02/2024 | I-Connect007In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback.