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Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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Registration Now Open for EIPC Winter Conference Lyon, France
January 20, 2023 | EIPCEstimated reading time: Less than a minute

Join the EIPC Winter Conference which is to be held over two days, 9-10 February 2023, the first in the famous Groupama Football Stadium in Lyon, wherein The Kopster Hotel Lyon Groupama Stadium will be our overnight stay venue; the second will be at the Bugey Nuclear Power Plant. In the evening of the first day we shall be dining, rather well, downtown Lyon centre.
The conference will have papers from Custer Consulting, EnergyVille, Ericsson, LiloTree, Trackwise, DP Patterning, Doosan, KLA, ASS Luippold, Dyconex, Suss MicroTec, RESONAC, NanYa and others. We will also be having a Round table for environmental matters e.g. REACH SVHC solder mask restrictions, involving companies such as Agfa, Electra Polymers, Notion Systems, SUSS MicroTec, Taiyo and Parachem.
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Klaus Koziol - atgSuggested Items
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