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Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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IPC SummerCom to Co-Locate with EWPTE
January 31, 2023 | IPCEstimated reading time: Less than a minute
The IPC SummerCom Standards Development Committee Meetings will be held in-person, from May 13–18, 2023, at the Wisconsin Center in Milwaukee, Wisconsin. IPC SummerCom will be co-located with the Electrical Wire Processing Technology Expo (EWPTE), the industry’s exclusive trade show for decision-makers who design, specify, purchase, install, sell, maintain or manufacture electronic cable assemblies, cord sets, wiring harnesses, and other related products.
IPC SummerCom is all about IPC Standards—welcoming your contribution to the industry standards and guidelines relied on by your company, customers, suppliers, and competitors. Moreover, registering to IPC Summercom provides attendees free access to EWPTE. The IPC Standard Development Committees cover a range of topics, including assembly and joining; assembly equipment, base materials, cleaning and coating; electronic product data description; embedded devices; flexible and rigid-flex printed boards; management; printed electronics; and more.
For more information or to register, contact Kim DiCianni, CEM, at KimDiCianni@ipc.org, or visit https://www.ipc.org/event/ipc-summercom.
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SMTA UHDI Symposium: Shortening the Learning Curve
01/15/2025 | Marcy LaRont, I-Connect007SMTA’s second annual UHDI Symposium on Jan. 23 in Phoenix will highlight groundbreaking discussions on UHDI assembly test board, innovative electronic inks, process controls, and signal integrity solutions. Organizer Tara Dunn talks about the importance of the event and how she prepared presentations and discussions that would appeal to fabricators, assemblers, and designers. This event will shorten your learning curve and spark new ideas that push the boundaries of hardware electronics manufacturing. There’s still time to register.
Happy’s Tech Talk #36: The LEGO Principle of Optical Assembly
01/14/2025 | Happy Holden -- Column: Happy’s Tech TalkDr. Steven Case of Avanti Optics Corporation once advocated a new approach to photonic assembly, based on the LEGO principle. He compared today’s erbium-doped fiber amplifier (EDFA) technology to the crude point-to-point wiring of early model circuit boards, which gave way to modern circuit boards that could be considered prefabricated interconnects.
SMTA Hosts Ultra High Density Interconnect Symposium
12/31/2024 | SMTAThe Surface Mount Technology Association (SMTA) is pleased to announce the Ultra High Density Interconnect (UHDI) Symposium, taking place on Thursday, January 23 2025, at the Peoria Sports Complex in Peoria, Arizona.
SP Manufacturing Expands with New Malaysia Plant, Acquires Ideal Jacobs
12/26/2024 | PRNewswireSP Manufacturing (SPM), a leader in Electronic Manufacturing Services (EMS), is strengthening its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and successfully acquiring Ideal Jacobs Corporation.