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Chemistry & Process Control from KYZEN at the SMTA Boise Expo
March 30, 2023 | KYZEN'Estimated reading time: Less than a minute
KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Boise Expo & Tech Forum, scheduled to take place Tuesday, April 11, 2023 at The Grove Hotel in Boise, Idaho. Visit KYZEN for answers regarding electronics cleaning challenges. Cleaning experts will be in the booth to provide a total cleaning solution.
KYZEN will be highlighting their award-winning combination of chemistry and process control. For more than 30 years, KYZEN's focus has been to look at the complete process and work with them to improve that process. Their aim is to ultimately increase yields, advance reliability and help to realize cost savings along the way. KYZEN’s newest aqueous cleaning chemistry, AQUANOX A4626, paired with the KYZEN PCS accomplishes that goal.
AQUANOX A4626 is easy-to-use and control, environmentally friendly, and has a long tank life that makes it safe for multi-pass applications. Using A4626 with the KYZEN Process Control System (PCS) to monitor and automatically react to the dynamic changes in the wash bath concentration completes the process. A4626 paired with the PCS is the perfect combination – Chemistry and Control are hard at work.
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Real Time with… IPC APEX EXPO 2024: Outlining Rehm's Innovations and Global Presence
05/01/2024 | Real Time with...IPC APEX EXPOMichael Hanke, the chief sales officer for Rehm Thermal Systems, shares insights on the North American market, new machinery, and software development. He also discusses Rehm's turnkey solutions, process flexibility, global presence, and the dedicated team of 700 employees working on global solutions.
The Knowledge Base: A CM’s Perspective on Box Build Practices
04/30/2024 | Mike Konrad -- Column: The Knowledge BaseIn the ever-evolving landscape of electronics manufacturing, the box-build process stands out as a critical phase that bridges the gap between individual component manufacturing and the delivery of a fully functional electronic system. This intricate procedure, encompassing the assembly of everything from PCBs to wire harnesses and mechanical enclosures, demands a high level of precision, efficiency, and innovation. As the electronics assembly industry expands and diversifies, understanding the best practices within box-build assembly has become paramount for manufacturers aiming to stay ahead in a competitive market.
TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips
04/30/2024 | PRNewswireAnsys announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs.
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow: