Nolan’s Notes: Moving Forward With Confidence
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
Smart Automation: AI—Revolutionizing Inspection in Electronics Manufacturing
Conecsus Metals Mexico to Exhibit Waste Recycling Solutions at SMTA Expo and Tech Forum
May 24, 2023 | Conecsus Metals MéxicoEstimated reading time: Less than a minute
Conecsus Metals México, an innovative environmental technology and recycling company, will exhibit at the SMTA Expo and Tech Forum in Aguas Calientes on June 1, 2023 beginning at 11:00 AM, at the Aguascalientes Marriott Hotel, Boulevard a Zacatecas Norte, S/N Aguascalientes, Aguascalientes 20116 Mexico.
Conecsus Metals México will showcase a variety of metals waste recycling solutions. With solder waste reprocessing facilities located in Terrell, TX, USA, Conecsus LLC is a sophisticated ‘green’ recycler and refiner of SMT solder/solder paste wastes and residues, as well as complex by-products that can be recovered from industries in North America and worldwide.
Conecsus representatives Yessica Romero, Regional Sales Manager, and Carolina Renteria, Customer Services Manager, illustrated how the company processes wastes containing primarily Tin, Tin-Zinc, Lead, and Silver, and converts them into usable metal products, paying its customers back for their metals waste. Conecsus is an ISO 14001 EMS certified recycling company and a refiner of SMT solder/solder paste wastes and residues.
Share on:
Suggested Items
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.