-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
An Exclusive Review of the Institute of Circuit Technology’s Annual Symposium
June 15, 2023 | Pete Starkey, I-Connect007Estimated reading time: 13 minutes
After a long crawl through heavy traffic on the M42 motorway, it was a great relief to exit at Junction 6 and arrive at the National Conference Centre for the 2023 Annual Symposium of the Institute of Circuit Technology on June 6.
The conference center is co-located with the historic National Motorcycle Museum and situated in the heart of the UK midlands, a stone’s throw from Birmingham International Airport. The delegates were welcomed by technical director Bill Wilkie. With reference to his grandson’s 5-a-side football team being instructed to “get into shape,” he commented on the changing shape of the UK PCB industry and how the Institute would continue to adapt to its geographical distribution in the choice of symposium and seminar venues. Interesting to see where we might be travelling to next year.
The keynote presentation came from Sue and Andy Critcher, partners in a design consultancy called Total Board Solutions, with a review of the latest design requirements for board fabricators.
Sue Critcher reflected upon developments in PCB design from the days of her apprenticeship, where she was hand-taping tracks and pads in the drawing office, to now using the latest design, simulation, and analysis tools, often with mixed analogue, digital, and RF technology on a single PCB. Besides the challenges of shrinking component dimensions, signal integrity, and power integrity considerations, and the increasing requirement for thermal management, project timescales are getting shorter, and the pressure is always to deliver the design more quickly at less cost.
Andy Critcher reviewed some of the implications of mixed signal designs and the importance of correctly defining the stackup, particularly with the increasing complexity of RF structures.
Documentation is a major concern. What data format to use: RS-274X or ODB++? RS-274X2, or even IPC-2581? He commented that not all versions of ODB++ are the same. Fabrication drawing data was another minefield, especially where the template was “copied from the last job.” Another danger area was specifications when the designer was not necessarily aware of the implications.
As designers, the Critchers displayed a remarkable awareness of the challenges faced by the PCB fabricator—a consequence of spending time over many years visiting, discussing, and collaborating. Common issues with data sent from designers included drawings and specifications, annular rings too small, minimum copper spacing, clearance to pad, copper distribution and copper balancing, etch compensation, teardrops, mouse and rat bites, slivers, as well as all sorts of solder mask and silk screen issues.
Andy Critcher spent some time discussing CAD-CAM checks, remarking, “We are checking the same thing, right?” He commented that several of the major CAD systems offer DFM capability, but remarked that although many CAD systems are available—he listed 24—each system is different.
What did the future hold? As a representative of the “old guard” who had started on the drawing board and come through the ranks, learning their craft from others along the way, Sue Critcher is concerned about the current status of the PCB design industry. The world of PCB design is changing. The average age increases by a year every year and the “old guard” is moving on. A recent survey indicated that 61% of designers are aged 50 plus, only 23% are younger than 35, and 55% of designers plan to leave the profession within the next 10 years, with more than 25% retiring within five years. The “new blood” is electronics engineers from university. CAD systems continue to improve but can only take them so far. Where will these engineers get their layout knowledge and learn good practices as PCB complexity increases? The parting advice from Sue and Andy: “Talk to your fabricators!”
Following the Total Board Solutions keynote, Bill Wilkie took the opportunity to award certificates to new corporate and individual members, and to make a special award to Lawson Lightfoot upon his retirement from the ICT Council. Bill acknowledged the enormous contribution that Lawson had made over many years, particularly in the area of technical training and the sharing of the educational resources of the Northern UK Circuit Group. He was appointed an Honorary Fellow of the Institute.
Page 1 of 2
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.