The Marketing Minute: A Brand Visibility Playbook—Get Seen, Heard, and Remembered
American Made Advocacy: Supporting the Entire PCB Ecosystem—Materials to OEMs
Marcy's Musings: The Hole Truth—Via Integrity in an HDI World
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
May 28, 2025 | TopLineEstimated reading time: 1 minute
Aerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments. They are a robust new ‘Next Gen’ solution to challenges facing large packages in electronics assembly.
On June 3 & 4, Martin Hart, President of TopLine Corporation and holder of multiple patents in the field of electronic components, will exhibit these remarkable breakthrough component solutions at Space Tech Expo 2025 in Long Beach, California in Booth #623.
“Braided Solder Columns are non-collapsible, robust and compliant electrically conductive connectors used for reducing stress caused by CTE mismatch between the component device and the PC board,” Hart says. “Columns are more reliable than solder balls, especially when connecting large-size chip packages to PC Boards operating in cryogenic environments. Additionally, they are available with lead for Aerospace & Defense applications, but also available in lead-free designs for RoHS AI Datacenters, for example.” For more information about the show, visit SPACETECHEXPO.com.
TopLine will also exhibit examples of TANAKA Bonding Wire; TANAKA Precious Metals is the premier manufacturer of bonding wire to the semiconductor industry. TopLine is a supplier of TANAKA bonding wire for many semiconductor uses and for EV applications.
Share on:
Suggested Items
IPC Launches New Wire Harness Design Course Led by Defense Industry Expert
06/03/2025 | I-Connect007 Editorial TeamIPC is expanding its educational offerings with a new online course designed to provide foundational knowledge in wire harness and cable design. The course, Introduction to Wire Harness Design I, is led by a seasoned mechanical engineer and subject matter expert in military cable systems working at FNSS Defense Systems in Turkey.
Microsembly Furthers RF Hybrid Manufacturing Services with New Automated Wire Bonding and Die Attach Equipment
05/30/2025 | MicrosemblyMicrosembly, a US-based provider of high-frequency contract manufacturing services, has announced the addition of new state-of-the-art automated and manual wire and ribbon bonders to its advanced RF and microwave assembly, manufacturing, and testing facility.
Redwire Successfully Delivers Onboard Computer for ESA’s Comet Interceptor Mission to Study Pristine Comet
05/27/2025 | BUSINESS WIRERedwire Corporation, a leader in space infrastructure for the next generation space economy, announced that it has successfully delivered the onboard computer for the European Space Agency’s (ESA) Comet Interceptor mission.
Yank Technologies Selected for Prestigious NASA Phase II Contract for Dust-Tolerant Resonant Connectors
05/20/2025 | PRNewswireYank Technologies, the developer of disruptive long range, high power wireless charging solutions, has been selected for a two-year follow-on Small Business Innovation Research (SBIR) Phase II contract from the National Aeronautics and Space Administration (NASA) to advance Dust-Tolerant Resonant Connectors for lunar and planetary surfaces.
Harnessing Connections: EWPTE 2025 Draws Nearly 3,000 Attendees
05/19/2025 | IPCThe 2025 Electrical Wire Processing Technology Expo (EWPTE), held May 6-8 at Baird Center in Milwaukee, Wis., provided 2,994 attendees the opportunity to meet, network and learn from the industry leading innovators and suppliers.