Cadence Digital, Custom/Analog Design Flows Certified for Samsung Foundry’s SF2 and SF3 Process Technologies
July 3, 2023 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes
Cadence Design Systems, Inc. announced that its digital and custom/analog flows achieved certification for Samsung Foundry’s SF2 and SF3 process technologies. The two companies also worked together to create new process design kits (PDKs) that simplify mobile, automotive, AI and hyperscale IC design at these latest nodes. Joint customers are actively developing SF2- and SF3-based designs using the Cadence® flows.
Cadence Digital Tools Optimized for SF2 and SF3 Technologies
Cadence’s comprehensive Cadence RTL-to-GDS design flow that supports Samsung’s SF2 and SF3 technologies provides optimal power, performance and area (PPA). The flow includes the Genus™ Synthesis Solution, Modus DFT Software Solution, Innovus™ Implementation System, Quantus™ Extraction Solution and Quantus Field Solver, Tempus™ Timing Signoff Solution and Tempus ECO Option, Pegasus™ Verification System, Liberate™ Characterization Portfolio, Voltus™ IC Power Integrity Solution and the Cadence Cerebrus™ Intelligent Chip Explorer.
With the certified flow, customers have access to several features that ease IC design at advanced nodes, such as cell-swapping support, which helps designers align cell pins for direct connections to conserve routing resources; support for mixed-row solutions in various combinations to maximize area-based design rules; the ability to place and refine traces using mask-shifted cells and horizontal half-track shifted cells to reduce displacement; support for various rectilinear standard cells to achieve higher density; and reduced IR drop due to the insertion of enhanced, trim-aware via staples.
Cadence Custom/Analog Tools Optimized for SF2 and SF3 Technologies
Cadence custom and analog tools optimized for Samsung’s SF3 and SF2 nodes include the AI-based Virtuoso® Studio design tools—Virtuoso Schematic Editor, Virtuoso ADE Suite and Cadence Virtuoso Layout Suite—the Spectre® Simulation Platform—Spectre X Simulator, Spectre FX and Spectre RF—as well as the Voltus™-XFi Custom Power Integrity Solution.
The custom/analog design tools provide customers with several benefits, such as better corner simulation management, statistical analyses, design centering and circuit optimization; support for parallel operations on modern compute farms and private and public cloud configurations; better performance and scalability throughout the layout environment; mixed-signal OpenAccess design kits for seamless integration with the Innovus Implementation’s place-and-route engines for improved quality of results; summarized EM-IR information, which highlights violations and details on resistance value, metal layer, width, and length information; and feedback regarding circuit performance and reliability.
“Through our latest collaboration with Cadence, we’ve seen early customers improve productivity with the Cadence-certified design flows and our advanced SF2 and SF3 process technologies,” said Sangyun Kim, vice president of the Foundry Design Technology Team at Samsung Electronics. “With the new PDKs, we’re making it easier for developers of next-generation mobile, automotive, AI and hyperscale designs to adopt our technologies and deliver innovations to market faster.”
“The Cadence R&D team worked tirelessly with the Samsung Foundry team to fine-tune our digital and custom/analog flows for Samsung’s SF2 and SF3 process technologies, delivering a wide range of benefits that help customers design much more efficiently,” said Vivek Mishra, corporate vice president in the Digital & Signoff Group at Cadence. “Our digital flow provides PPA advantages, and our custom/analog flow, anchored by Virtuoso Studio, sets a new standard for custom IP creation, enabling our mutual customers to push the boundaries of innovation with Samsung’s SF2 and SF3 process technologies.”
The Cadence digital and custom/analog flows support the Cadence Intelligent System Design™ strategy, enabling system-on-chip (SoC) design excellence.
Suggested Items
Podcast Review: On the Line with… Designing for Reality
05/09/2024 | Duane Benson, Positive Edge LLCAs a technologist, if I were forced to come up with just one recurring theme that I might call a professional “nemesis,” it would be the difference between theory and reality. A lot of technology we have at our disposal works well in theory but falls short when reality hits. That’s not the only reason I chose to listen to and review On the Line with… Designing for Reality, featuring a series of conversations with ASC Sunstone’s Matt Stevenson, but it certainly helped that the title caught my eye.
EMA Webinar: Next Generation MCAD/ECAD for SOLIDWORKS
05/09/2024 | EMA Design AutomationLearn how the MCAD and ECAD experts at Hawk Ridge and EMA can help you solve your MCAD/ECAD integration challenges with this unique collaboration environment.
Sondrel Awarded New Video Processor ASIC Design and Supply Contract
05/09/2024 | SondrelSondrel, a leading provider of ultra-complex custom chips for leading global technology brands, is pleased to announce that it has won a major ASIC design and supply contract for a next generation, video processing chip.
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.