-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
BTU will Showcase Innovative Aqua Scrub Flux Management Technology at SMTA International
September 7, 2023 | BTU International, Inc.Estimated reading time: 1 minute

BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at SMTA International 2023. The event is scheduled to take place October 9-12, 2023 at the Minneapolis Convention center in Minneapolis, MN. BTU to showcase its groundbreaking Aqua Scrub™ flux management technology, for its Pyramax™ and Aurora™ reflow ovens in Booth #1221.
“The Aqua Scrub flux management system has been a game changer for many of our high-volume reflow customers,” said Isaiah Smith, regional sales manager for BTU International. “The latest generation of Aqua Scrub is even more effective, with the use of our proprietary AQSB-300 solution – making the payback period even shorter than before,” added Smith.
Designed for seamless integration with the Pyramax and Aurora reflow ovens, the Aqua Scrub sets new standards in solder reflow flux management. The stand-alone unit is ingeniously engineered to retrofit onto existing BTU reflow ovens or be incorporated into new units, ensuring a smooth transition without compromising oven operation or factory floor space.
Aqua Scrub introduces a new era of operational efficiency, significantly reducing costs by up to 4X compared to conventional condensation systems. The patent-pending design harnesses aqueous-based scrubber technology compatible with a wide spectrum of paste and flux varieties. This innovative approach not only drives cost savings but also enhances environmental sustainability.
BTU International invites attendees to discover the future of reflow oven flux management technology at their booth during SMTA International. Discover how Aqua Scrub's pioneering approach is revolutionizing solder reflow processes, enhancing efficiency, and delivering unmatched value to the industry.
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.