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Fuji America and Cybord Form Strategic Partnership to Deliver Visual AI-Powered Technology to SMT Production Lines

01/22/2025 | Cybord
Reinforcing Fuji America’s commitment to industry leading solutions, this partnership will utilize Cybord’s unique technology to usher in a new era of quality in electronic manufacturing.

Ensuring Compliance With the U.S. CHIPS Act: Identifying the Source of Electronic Components

01/13/2025 | Dr. Eyal Weiss, Cybord
The U.S. CHIPS Act aims to strengthen domestic semiconductor manufacturing and enhance supply chain security. As part of this initiative, manufacturers must ensure compliance with specific regulations regarding the sourcing of electronic components. This white paper provides an overview of the compliance requirements, relevant laws and standards, and introduces innovative technological solutions to verify the provenance of electronic components.

Global Sourcing Spotlight: The Surprising World of Offshore B2B Industrial Values

01/08/2025 | Bob Duke -- Column: Global Sourcing Spotlight
When people want to buy industry products, they often look at a list of products: PCBs, PCBAs, injection molding, batteries, and transformers. However, if you bypass brick-and-mortar facilities, you can usually find better-value products if you search the globe. This is especially true with B2B products. With the right strategy and a keen eye for quality, companies can uncover opportunities to source essential industrial products from offshore suppliers at competitive prices. Here’s a list of some of those products and where to source them.

Hon Hai Research Institute Publishes AI-Driven Silicon Carbide Technology in IEEE OJPEL

01/01/2025 | Hon Hai Technology Group
Hon Hai Technology Group announced that its Semiconductor Research Institute has successfully combined AI learning models with reinforcement learning to accelerate the research and development of silicon carbide power semiconductors.

Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 5

12/23/2024 | I-Connect007 Editorial Team
Chapter 5 introduces the advantages of using low-temperature soldering for through-hole components, including cost efficiency, reliability improvement, and reduced warpage. Also covered: the evaluation of different fluxes and the performance of HRL3 in wave soldering and selective soldering processes.
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