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ASC Sunstone Proudly Sponsors SMTA’s Ultra High-Density Interconnects (UHDI) Event
February 27, 2024 | ASC SunstoneEstimated reading time: 1 minute
ASC Sunstone, a leading provider of high-quality printed circuit board (PCB) solutions, is pleased to announce its sponsorship of the upcoming Ultra High-Density Interconnects (UHDI) event hosted by the Surface Mount Technology Association (SMTA). The event, titled "Advancements in HDI: Driving Innovation Forward," will serve as a platform for industry professionals to explore the latest trends and technologies in high-density interconnects.
Scheduled to take place on March 26th, the event will feature presentations from renowned experts in the field which will include John Johnson from ASC Sunstone. Topics will cover advances in UHDI design, manufacturing processes, material innovations, and reliability considerations.
As a company committed to innovation and excellence in PCB manufacturing, ASC Sunstone recognizes the importance of supporting events like this that promote industry advancement and facilitate meaningful dialogue among peers.
"We are thrilled to sponsor the SMTA UHDI event," said Anaya Vardya, CEO of ASC Sunstone. "Innovation in ultra high-density interconnects is driving significant changes in the electronics industry, and we are proud to be at the forefront of this evolution. This event provides an invaluable opportunity for professionals to come together, share insights, and collaborate on shaping the future of UHDI technology."
The event will take place at Peoria Sports Complex in Peoria, AZ, and registration is open to professionals from across the electronics manufacturing industry. Attendees can register for the event on the SMTA website at smta.org/mpage/uhdi.
Educational titles from American Standard Circuits:
- Podcast: On the Line with...ASC Sunstone, Designing for Reality
- The Printed Circuit Designer’s Guide to… Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to… Flex and Rigid-Flex Fundamentals
- The Companion Guide to Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator's Perspective
Visit I-007eBooks.com to download these and other free titles.
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Brent Fischthal - Koh YoungSuggested Items
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08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
Technica Demo Days Event Proves to Be Beneficial to Customers
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Review: PCEA Orange County Summer Meeting
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Register Now for the HATS²™ Technical Day at GEN3 HQ
08/05/2025 | GEN3GEN3 a world-leading manufacturer of testing, measurement and production solutions for electronics reliability. Headquartered in Farnborough, UK, GEN3 is announcing the final call for registrations to attend the exclusive HATS²™ Technical Day — a hands-on, live demonstration event showcasing the Highly Accelerated Thermal Shock Tester (HATS²™), the groundbreaking innovation from industry pioneer Bob Neves.
Strengthening U.S.-Japan Industry Ties
08/11/2025 | Yusaku Kono, Global Electronics Association—East Asia Japan RepresentativeThe Global Electronics Association-East Asia (formerly known as IPC East Asia) hosted a high-level Executive Roundtable in Tokyo on March 5, bringing together more than 50 senior executives, policymakers, and experts from Japan’s electronics and manufacturing sectors.