Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
SMTA Ultra High-Density Interconnect Symposium Is Nearly Here
February 27, 2024 | SMTAEstimated reading time: 2 minutes
SMTA will be hosting a new symposium on March 26th in Phoenix focused on Ultra High-Density Interconnect (HDI) technology. As the semiconductor industry charges forward, demanding ever-increasing performance and miniaturization, the SMTA Ultra HDI Symposium sets the stage for industry pioneers, researchers, engineers, designers, and academia to engage in the active sharing of information while addressing the complexities and innovations reshaping the world of Ultra HDI technology. As feature sizes continue their relentless journey towards miniaturization, this symposium will provide insight into the rapidly evolving landscape of Ultra HDI: PCB Design, Fabrication, Assembly, and Reliability. Topics will include:
- Bridging the gap between OEM demands and Ultra HDI innovation
- Materials that redefine Ultra HDI possibilities
- Paradigm-shifting PCB fabrication techniques
- Assembly success: overcoming challenges in shrinking feature sizes
- Design strategies that address both complexity and performance
- Ensuring reliability in Ultra HDI solutions
- Interplay between Ultra HDI and the burgeoning semiconductor landscape
From our presenters and sponsors –
“Celebrating the convergence of advanced technology and miniaturization, the SMTA UHDI Symposium offers a window into the future of PCBs. With UHDI technology at its core, this event illuminates the path toward smaller yet more powerful electronic component. … Joining industry pioneers at this conference isn't just about staying informed – it’s an opportunity to immerse yourself in the latest advancements with industry experts, connect with peers, and be at the forefront of innovation. – PRESENTER, Jan Pedersen, NCAB Group
“In my opinion, ultra HDI manufacturing is a game-changer for PCB fabricators in North America, enabling the production of highly complex and densely populated boards that meet the demands of advanced applications. … By embracing even select UHDI processing techniques, which will be highlighted in this year’s SMTA UHDI Symposium, PCB fabricators can differentiate themselves and deliver cutting-edge solutions that drive growth and success in the industry." – PRESENTER, Raanan Novik, KLA
"Peoria is thrilled to showcase its momentum in the semiconductor sector through the prestigious SMTA Global Conference," said Jennifer Stein, Director of Economic Development. "The recent addition of Amkor to our city underscores our commitment to fostering innovation and creating opportunities for growth in advanced manufacturing and related industries. Our infrastructure, great year-round climate, and access to specialized talent make Peoria a great location for businesses to expand or relocate.”
Thought leaders and experts from across a broad spectrum are invited to attend and contribute to the discussion and to help accelerate the development and implementation of this important technology and ultimately, shorten the time to move from the prototyping phase of process and product development to a proven process in the high mix, low volume manufacturing environment.
The SMTA Ultra-HDI conference will be held on March 26th, 2024 at the Peoria Sports Complex at 16101 N. 83rd Ave., Peoria, AZ. Registration is now open at SMTA.org.
Share on:
Suggested Items
The Death of the Microsection
06/26/2025 | Bob Neves, Reliability Assessment Solutions, Inc.I got my start out of college grinding and polishing PCB microsections. My thumbs are a bit arthritic today because of the experience (microsection grinders know what I mean). Back then, via structures were rather large, and getting to the center in six steps of grinding and polishing was easy compared to what my team has been doing recently at the lab.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
American Standard Circuits to Exhibit at IMS 2025
06/12/2025 | American Standard CircuitsAnaya Vardya, President and CEO of American Standard Circuits & ASC Sunstone Circuits, announced that his companies will exhibit at the IEEE International Microwave Symposium (IMS 2025), taking place June 15-20, 2025, at San Francisco’s Moscone Center.
UHDI Fundamentals: UHDI Drives Unique IoT Innovation—Smart Homes
06/03/2025 | Anaya Vardya, American Standard CircuitsThe combination of UHDI's high-bandwidth capabilities and IoT's real-time data processing can lead to more efficient, immersive, and smarter IoT systems. This convergence of two revolutionary technologies is enabling quantum advancements in some very “unconventional” applications.
Choosing the Right Strategic Path
04/29/2025 | Marcy LaRont, PCB007 MagazineTom Yang, CEO of CEE PCB, discusses the current economic challenges, noting reduced purchasing power post-pandemic. He highlights the growing demand for HDI in consumer electronics due to AI growth. Tom also expresses concerns about tariffs under the new U.S. administration, prompting CEE to diversify production locations, including new plants in Southeast Asia. He emphasizes the need for PCB manufacturers to adapt strategically amidst rising costs and fierce competition, particularly for mid-sized shops facing unique challenges in the industry.