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Stencil and PCB Cleaning Solutions from KYZEN at SMTA Monterrey
February 27, 2024 | KyzenEstimated reading time: 1 minute

KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum, scheduled to take place Thursday, March 14, 2024 at the Cintermex Convention Center, Hall 2A in Monterrey, Nuevo León. KYZEN will showcase the new aqueous chemistry AQUANOX A4618 in addition to highlighting stencil cleaning chemistries KYZEN E5631J and CYBERSOLV C8882.
AQUANOX A4618 is a versatile and easy-to-use aqueous cleaning chemistry designed to clean the latest lead-free flux residues including Pb-free and no-clean fluxes, providing mirrored solder finishes. A4618 works exceptionally well at low temperatures and concentrations, benefits from an adjusted stabilizer package, boasts a long tank life, and is safe for multi-pass applications.
KYZEN E5631J is a ready-to-use, cost-effective solution for removing raw solder paste from stencils in online and offline stencil cleaning processes. Proven compatible with common stencils, cleaning equipment, and printer manufacturers, E5631J quickly and efficiently cleans all types of raw solder paste to ensure every print counts. For understencil wipe applications, CYBERSOLV C8882 is a solvent-based cleaning fluid designed to clean solder paste, uncured SMT adhesive, and flux residue from stencils, misprinted PCBs, stencil tools, and printing squeegees.
For more than 30 years, KYZEN has developed innovative chemistries to work hand-in-hand with your cleaning process. Chemistries including AQUANOX A4618 and stencil cleaners like KYZEN E5631J and CYBERSOLV C8882 assist in ensuring your process is worry-free.
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Indium Corporation Introduces New Flip-Chip Flux for Semiconductor Devices
07/31/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux designed to meet the demands of cutting-edge semiconductor devices.