Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
StenTech to Unveil Cutting-Edge StenTech BluPrint™ CVD Surface Treatment at 2024 IPC APEX EXPO
March 12, 2024 | StenTechEstimated reading time: 1 minute
StenTech® Inc., a leading global company specializing in SMT Printing Solutions, will introduce the new StenTech BluPrint™ Chemical Vapor Deposited (CVD) Surface Treatment at the 2024 IPC APEX EXPO. This groundbreaking technology, designed to enhance SMT processes with unparalleled benefits for stencil performance, longevity, and overall assembly quality, will be showcased for the first time in Booth 1608 from April 9-11, 2024 at the Anaheim Convention Center in California.
The relentless drive to shrink components and circuit boards poses challenges in solder paste printing with laser-cut stainless-steel stencils. StenTech BluPrint™ CVD emerges as the premier solution in North America, aligning with the intricate demands of the semiconductor and EMS industry, backed by cutting-edge laser technology advancements.
StenTech BluPrint™ CVD Surface Treatment introduces a revolutionary method of depositing thin films onto a substrate by introducing chemical precursors into a reactor chamber, resulting in a solid material deposit on the surface. The consistency achieved across all areas distinguishes StenTech's CVD from traditional liquid spray processes, providing a resilient, virtually indestructible coating that ensures uniform printing with identical apertures.
Beyond consistent thickness, StenTech BluPrint™ offers exceptional thermal stability, chemical inertness, anti-stiction properties, a refined smooth surface finish, customizable characteristics, and unmatched print quality consistency. The process begins with plasma polishing, followed by the chemical vapor deposition, resulting in a smoother sidewall and enhanced corrosion resistance.
StenTech BluPrint™ stands out with its application at approximately 1000 times less thickness compared to existing alternatives, ranging from 3-5 micrometers versus 3 nanometers. Positioned as the practical choice for coating high-end SMT solder paste stencils, StenTech BluPrint™ promises noticeable enhancements in transfer efficiency, outperforming current nano-coatings, particularly in high-volume builds.
StenTech invites attendees to Booth 1608 at the 2024 IPC APEX EXPO to explore the StenTech BluPrint™ CVD Surface Treatment and experience firsthand its transformative impact on SMT processes.
Share on:
Suggested Items
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
07/01/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.
SMT007 Magazine July—What’s Your Competitive Sweet Spot?
07/01/2025 | I-Connect007 Editorial TeamAre you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche—what are their insights? In the July 2025 issue of SMT007 Magazine, we spotlight companies thriving by redefining or reinforcing their niche and offer insights to help you evaluate your own.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.
NVIDIA RTX PRO 6000 Shipments Expected to Rise Amid Market Uncertainties
06/24/2025 | TrendForceThe NVIDIA RTX PRO 6000 has recently generated significant buzz in the market, with expectations running high for strong shipment performance driven by solid demand.
Green Circuits Boosts Test Capacity with New Takaya APT-1600FD System
06/24/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce the purchase of its fourth Takaya APT-1600FD Double-sided Flying Probe Test System.