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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
March 15, 2024 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
Good morning! How are you all doing today? I need another cuppa Joe!
It was a busy week in PCB design and manufacturing. This has been a pretty “dense” week, and this week’s Top Five features an article on density equations by Happy Holden, and a news item about the SMTA UHDI symposium in Phoenix. We also have news about our latest podcast, and a Chris Mitchell column about economic security here and abroad. And Todd Kolmodin discusses the ins and out of 4-wire Kelvin testing, and he tells us a little about Lord Kelvin himself.
It’s trade show season, and we’ll be covering SMTA shows in Dallas and Phoenix, as well as IPC APEX EXPO. We hope to see you on the road.
Happy’s Tech Talk #26: Balancing the Density Equation
Published March 14
This is a great article on density, by Happy Holden, “Mr. HDI.” If you need to figure out wiring demand and substrate capacity, look no further. Happy breaks it all down in layman’s terms, which is nice, because this can be a pretty “dense” topic.
SMTA Announces Workforce Development Breakfast at Ultra High Density Interconnect (UHDI) Symposium
Published March 13
UHDI has been gaining traction for the last few years, and it’s only fitting that SMTA is holding a symposium in Phoenix that’s dedicated to designing and manufacturing these tiny lines and spaces. This will be a good show, so if you’re in the Phoenix area, check it out.
New Episode Now Available: Designing for Reality—CAM, Materials, and Imaging
Published March 14
Our podcasts have really taken off, and our latest “pod” is no exception. In this episode, ASC Sunstone VP/Manager Matt Stevenson discusses DFR—Designing for Reality. Isn’t that what PCB design is all about in the first place?
The Government Circuit: Driving Resiliency and Economic Security on Both Sides of the Atlantic
Published March 12
In this column, Chris Mitchell discusses the DoD’s “strategy for industrial strength,” and IPC’s latest lobbying efforts in Washington. IPC’s government relations folks are doing a job that I wouldn’t want to do. They really stay on top of these politicians and hold them to their word, because they’ll promise us the moon and stars during an election year.
Testing Todd: Why 4-wire Kelvin?
Published March 8
Why should you use 4-wire Kelvin? Todd Kolmodin has an answer to this question. In this column, Todd explains how 4-wire Kelvin testing has found a new home in the high-speed substrate, HDI, and microwave markets.
Suggested Items
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
11/15/2024 | IPCEach year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2025 will feature Kevin Surace, an internationally renowned futurist and generative artificial intelligence (AI) innovator.
OE-A Business Climate Survey: 2024 Slowdown, 2025 Set to Shine
10/10/2024 | OE-AThe survey predicts revenue growth of +7 percent for 2024, a significant decrease from the previous survey (March 2024: 13 percent). However, optimism remains high for 2025, with a forecast growth of 19 percent.
Q1 Global Semiconductor Sales Increase 15.2% YoY
05/07/2024 | SIAThe Semiconductor Industry Association (SIA) announced worldwide sales of semiconductors totaled $137.7 billion during the first quarter of 2024, an increase of 15.2% compared to the first quarter of 2023 but 5.7% less than the fourth quarter of 2023.
North American PCB Industry Sales Down 23.8% in March
04/29/2024 | IPCIPC announced the March 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.13.
North American EMS Industry Down 4% in March
04/29/2024 | IPCIPC announced the March 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.31.