Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
Save the Date: 2024 NW Electronics Design & Manufacturing Expo (NEDME)
March 19, 2024 | NEDMEEstimated reading time: 1 minute
The Electronics Manufacturers Association of Oregon (EMA) and the Electronics Representatives Association (ERA) are thrilled to announce the 2024 NW Electronics Design & Manufacturing Expo (NEDME), scheduled for October 30th. NEDME is the Pacific Northwest’s premier platform for industry professionals to delve into the latest advancements and trends in electronics manufacturing.
NEDME, organized by the EMA and the ERA, is a cornerstone event for professionals in the electronics sector, offering great networking, mentorship, and educational opportunities. The expo will feature engaging exhibits, captivating keynote presentations, technical sessions, and invaluable networking prospects. It stands as an ideal forum to expand professional connections, gain insights into emerging technologies, and encourage growth and innovation within the industry.
Join us on October 30th at the Wingspan Event & Conference Center at Westside Commons in Hillsboro to immerse yourself in the dynamic ambiance of NEDME. Further details and registration information will soon be available through our official communication channels and website, www.nedme.com.
Details:
Date: Wednesday, October 30, 2024
Time: 8:00 AM – 4:00 PM
Location: Wingspan Event & Conference Center at Westside Commons, Hillsboro, Oregon
Those interested in exhibiting: Please contact board@nedme.com for details and to reserve your booth space.
Those interested in sponsoring: NEDME offers exceptional sponsorship opportunities for companies aiming to expand their presence within the manufacturing community in and around Oregon. For more details about supporting local manufacturers and enhancing supply chains, please reach out to EMA at board@nedme.com.
As in previous years, a portion of admission proceeds will be donated to the Oregon Food Bank by NEDME.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
TTCI and The Training Connection Strengthen Electronics Manufacturing with Test Services and Training at PCB West 2025
09/16/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB West 2025, taking place Wednesday, October 1, 2025, at the Santa Clara Convention Center in California. Visitors are invited to Booth 113 to explore the companies’ complementary expertise in test engineering services and workforce development for the electronics industry.
Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market
09/16/2025 | Jesse Vaughan -- Column: Beyond the BoardThe MilAero electronics supply chain offers opportunities for manufacturers that are both prestigious and strategically important. Serving prime contractors and Tier-1 suppliers can mean long-term program stability and the satisfaction of contributing to national security. At the same time, this sector is unlike commercial electronics in almost every respect. Success requires more than technical capabilities, it requires patience, preparation, attention to detail, and a clear understanding of how the business model differs.
India’s Aerospace and Defence Engineered for Power, Driven by Electronics
09/16/2025 | Gaurab Majumdar, Global Electronics AssociationWith a defence budget of $82.05 billion (2025–26) and a massive $223 billion earmarked for aerospace and defence spending over the next decade, India is rapidly positioning itself as a major player in the global defence and aerospace market.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Global Interposer Market to Surge Nearly Fivefold by 2034
09/15/2025 | I-Connect007 Editorial TeamRevenue for the global interposer market is projected to climb from $471 million in 2025 to more than $2.3 billion by 2034, according to a new report from Business Research Insights. The growth represents a CAGR of nearly 20 percent over the forecast period.