Imec Demonstrates Compact 32-Channel Silicon-Based Wavelength Filter with Low Loss and High Tuning Efficiency
April 1, 2024 | ImecEstimated reading time: 2 minutes
In a top-scored paper at the OFC Conference (San Diego), imec, a world-leading research and innovation hub in nanoelectronics and digital technologies, is presenting a major advancement in silicon-based wavelength-division multiplexing (WDM) capability. A compact 32-channel silicon-based wavelength filter is demonstrated for the first time with low loss and high tuning efficiency, enabling a 4x increase in the number of transmitted and received wavelength channels compared to today’s commercial transceivers. The demonstrated capability will enable continued scaling of the bandwidth density and power efficiency of next-generation silicon-photonics-based transceivers, addressing the requirements for short-reach optical interconnects in high-performance AI/ML compute clusters.
Continued scaling of optical interconnects is essential for achieving further performance and efficiency gains in AI/ML compute clusters. Silicon photonics is a key technology platform for cost-effective integration of Tbps-scale transceivers, but the demanding requirements for bandwidth density, power efficiency, and latency in AI/ML system interconnects require substantial improvements at the process, device, and circuit level. For example, scaling up link bandwidth by adding more wavelength channels is typically associated with significant optical losses and excessive tuning power when using silicon-integrated components.
By combining the advanced Si patterning capability in imec’s 300mm silicon photonics platform (iSiPP300) with innovative and highly optimized designs of Si ring resonator and interleaver components, imec has overcome these challenges, realizing a WDM filter with 32 wavelengths at 100GHz channel spacing in the O-band, matching the specifications of the CW-WDM multi-source agreement (MSA). Owing to the careful design optimization, low optical insertion losses of about 2dB and crosstalk levels better than 16dB are maintained, even at this high channel count. By leveraging imec’s local Si substrate undercut process and optimized heater designs, the thermo-optic tuning efficiency is among the best-reported values at 290GHz/mW.
Joris Van Campenhout, fellow and R&D program director at imec: “Imec’s optical I/O R&D program aims at disruptive scaling of both bandwidth density and power consumption of silicon-integrated optical interconnects, which often present conflicting requirements. Our new 32-channel WDM filter enables Tbps-scale aggregate bandwidth per optical fiber using individual lane rates of only 32Gbps, enabling error-free link operation without power-hungry digital signal processing. Leveraging its compact footprint, low optical losses, and high wavelength tuning efficiency, the demonstrated WDM filter opens a pathway to Tbps/mm-scale optical interconnects with overall power efficiencies of just 1pJ/bit.”
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
Micro LED CPO Optical Transceiver Market to Reach $848M by 2030
05/11/2026 | TrendForceTrendForce’s latest research into the Micro LED industry highlights how generative AI is driving rapid growth in demand for high-speed optical communications.
Molex Completes Acquisition of Teramount Ltd.
05/07/2026 | PRNewswireMolex, a global electronics leader and connectivity innovator, has completed the acquisition of Teramount Ltd., an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimized for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.
NVIDIA, Corning Partner to Boost U.S. AI Manufacturing
05/06/2026 | BUSINESS WIRENVIDIA and Corning Incorporated announced a multiyear commercial and technology partnership to dramatically expand U.S.-based manufacturing of the advanced optical connectivity solutions needed to power next-generation AI infrastructure.
AI Interconnect Boom Drives Southeast Asia Outsourcing Expansion
05/05/2026 | TrendForceGlobal shipment volume of optical transceivers is projected to more than triple from 26.5 million units in 2023 to over 92 million units by 2026, according to TrendForce’s latest AI infrastructure research.
GlobalFoundries Advances Co-Packaged Optics for AI Data Centers with SCALE Module
05/04/2026 | GlobalFoundriesGlobalFoundries (Nasdaq: GFS) (GF) announced the introduction of its SCALE™ optical module solution for co-packaged optics (CPO).