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Advanced Electronics Packaging Digest

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Six Suppliers Bet on VCSEL NPO as Demand Hits 650 Million Units by 2031

10/09/2026 | TrendForce
TrendForce’s latest report, “2027 Infrared Sensing and Optical Communication Market Trend”, shows that rapidly growing demand for data transmission in expanding data center networks is increasing interest in VCSEL-based near-packaged optics (NPO).

CScale Exits Stealth With $145M to Build AI Interconnects

09/30/2026 | BUSINESS WIRE
CScale exited stealth, announcing $145 million in Series C funding to accelerate development and commercialization of optical interconnect for AI scale-up, the high-bandwidth, ultra-low-latency connections that let accelerators work together like a single, much larger computer.

Q/C Technologies Announces Research Collaboration with Sandia National Laboratories

09/30/2026 | Globe Newswire
Q/C Technologies, Inc.., a developer of next-generation optical computing solutions, announced a collaboration with the Center for Integrated Nanotechnologies (CINT) at Sandia National Laboratories (Sandia) to advance its proprietary optical processing unit (OPU) initiative for artificial intelligence inference.

Vuzix Introduces Shrike Defense Display Platform and Ships Initial Evaluation Units

09/29/2026 | PRNewswire
Vuzix® Corporation, a supplier of AI-powered smart glasses, waveguides for smart glasses and co-packaged optical data center interconnects, and related augmented reality technologies, introduced Vuzix Shrike™, a configurable waveguide display platform for defense, security and first responder applications.

SMART Photonics, GlobalFoundries Partner on Open-Access Silicon-Photonics Foundry Service

09/24/2026 | GlobalFoundries
SMART Photonics B.V. announced its partnership with GlobalFoundries (GF) to offer a new open access foundry service combining GF’s scalable and production-proven silicon platform with SMART Photonics’ high-volume indium phosphide photonic integrated circuits (PICs), including lasers and modulators.
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