-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Collaboration and Innovation: Insights from SMTA's First UHDI Symposium
April 2, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: 1 minute
Anaya Vardya provides valuable insights on industry collaboration and innovation at the first SMTA UHDI Symposium, delving into the necessity of collaboration in driving innovation and progress within our industry. He shares his experience in helping put this event together, and pride in being a part of bringing the UHDI test board to life.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Sony Semiconductor Solutions, TSMC Enter Preliminary Agreement for Next-Generation Image Sensor Strategic Partnership
05/08/2026 | TSMCSony Semiconductor Solutions Corporation and TSMC announced the signing of a non-binding memorandum of understanding (MOU) to form a strategic partnership for the development and manufacturing of next-generation image sensors.
Global Electronics Association and CalcuQuote, an Elisa Industriq Business, Launch Joint Supply Chain Intelligence Initiative
04/29/2026 | Global Electronics AssociationThe Global Electronics Association and CalcuQuote, Elisa Industriq today announced a partnership to deliver timely, actionable supply chain intelligence for the electronics industry.
NEC Announces Strategic Collaboration with Anthropic Focused on Enterprise AI
04/27/2026 | JCN NewswireNEC Corporation announced a strategic collaboration with Anthropic PBC (Anthropic,) to accelerate the utilization of AI in the Japanese enterprise sector.
Global Turbine Asia Boosts Aerospace Growth and Talent Through Strategic Partnerships
04/21/2026 | ACN NewswireThe MoUs reflect GTA’s strategic focus on strengthening the aerospace and defence ecosystem through cross-border commercial cooperation, talent development, research partnerships and long-term capability building, aligned with evolving regional industry needs.
Cadence, Google Scale AI Chip Design with ChipStack on Google Cloud
04/16/2026 | Cadence Design SystemsCadence, an industry leader in AI-driven computational software for semiconductor and system design, announced a strategic collaboration with Google to optimize the Cadence® ChipStack™ AI Super Agent with Gemini on Google Cloud.