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Spring Into the Latest Issue of IPC Community
April 9, 2024 | IPC Community Editorial TeamEstimated reading time: Less than a minute

You’ve put away the winter gear, the bulbs are in bloom, and the latest issue of IPC Community is ready for you.
Some highlights:
- Dr. John W. Mitchell highlights what’s happening at IPC APEX EXPO this week, and we showcase the Trade Show Committee – you know there’s a lot of hard work behind the scenes to make this event happen.
- Hair dryers to remove components? That’s no more with this update on IPC-7711/21. Dan Foster and Agnieszka Ozarowski share what’s on the horizon for this important guideline.
- 15,000 miles. It’s more than halfway around the world, and the number of miles conformal coating specialist Phil Kinner has run in the past six years. Get the story behind this amazing feat on feet.
- Zooming In: Get tips from Zentech Manufacturing on how to take advantage of a new apprenticeship model now endorsed by the U.S. Department of Labor.
And that’s just the beginning of the stories we’re sharing in our Spring 2024 issue.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.
Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.