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IFTEC’s Pierre-Jean Albrieux Inducted into the IPC Raymond E. Pritchard Hall of Fame at IPC APEX EXPO 2024
April 11, 2024 | IPCEstimated reading time: 1 minute
In recognition of his extraordinary contributions to IPC and the electronics manufacturing industry, Pierre-Jean Albrieux, president of IFTEC-France, was inducted into the IPC Raymond E. Pritchard Hall of Fame at IPC APEX EXPO 2024. IPC’s most prestigious honor, the Hall of Fame Award is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry.
Albrieux was honored for his enthusiastic support for IPC’s mission to serve the electronics industry as an advocate for IPC training and certification. Under Albrieux’s leadership, IFTEC has translated multiple IPC standards, training programs for IPC certifications, and Certified IPC Designer and Certified IPC Designer+ study guides into French. IFTEC has been involved in IPC hand soldering competitions in France since 2016, with staff serving as judges at competitions and championships throughout Europe. IFTEC staff members also participate in approximately 30 standards development and training committees.
A winner of the IPC President’s Award in 2016, Albrieux was recognized for shaping IFTEC into a leading and model IPC Training and Certification Center and Distributor in Western Europe, growing IPC membership in France and promoting IPC services to industry and for overseeing the creation of the IPC Design Council Chapter in France.
Albrieux is deeply involved in the industry in France, especially with SNESE, (National Association of French Electronic Subcontracting Firms, the representative body of electronic subcontracting trade in France since 1983.
IPC President and CEO John Mitchell notes Albrieux’s accomplishments, “Those who work closely with Pierre-Jean immediately recognize his expertise, strong leadership skills and the knowledge and experience he possesses to accomplish as much as he has. He is respected as a subject matter expert, always ready to move the industry forward as a strong advocate for the development and use of IPC standards in France and beyond.”
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Sweeney Ng - CEE PCBSuggested Items
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10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
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North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
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Industry Leaders Shape a Sustainable Future at 2025 IPC CEMAC Electronics Manufacturing Annual Conference
09/30/2025 | Global Electronics AssociationThe 2025 IPC CEMAC Electronics Manufacturing Annual Conference, co-hosted by the Global Electronics Association and the Shanghai Pudong Association for Quality and Technology, successfully concluded on September 26 in Shanghai.