Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

SEL: Revolutionizing PCB Production Through MES, Partnerships, and Vision

08/21/2025 | Barry Matties, I-Connect007
Two years ago, we visited Schweitzer Engineering Laboratories (SEL) to better understand its new captive greenfield PCB facility. We recently returned, this time to discuss how this bold vision has transformed the industry. Barry Matties met with John Hendrickson, engineering director, and Jessi Hall, vice president of vertical integration, to discuss the transformative capabilities of Factory Core, SEL’s custom manufacturing execution system (MES), which allows for real-time monitoring of workflow and machine performance, and has led to impressive improvements in quality and cost efficiency.

Real Time with... IPC APEX EXPO 2025: GreenSource's Growth and Future Developments

04/15/2025 | Real Time with...IPC APEX EXPO
Things are looking bright for GreenSource. Michael Gleason shares an update on GreenSource's recent growth and upcoming changes. A recipient of a Defense Production Act Investment Program award, GreenSource is planning for new substrate capabilities. Current investments continue to enhance equipment and sustainability initiatives such as water quality. And their unique collaboration with the University of New Hampshire continues to aid their workforce development, despite recruitment challenges.

DOD Awards $46.2 Million to Revitalize the U.S. Defense Industrial Base On-Shoring of Advanced Packaging and Assembly

12/22/2023 | U.S. Department of Defense
The Department of Defense announced an award of $46.2 million to GreenSource Fabrication LLC (GreenSource) via the Defense Production Act Investment (DPAI) Program. The award will enhance existing production capabilities at a manufacturing facility of state-of-the-art integrated circuits (IC) substrate, high-density interconnect (HDI) and ultra-high-density interconnect (UHDI), and advanced packaging.

DOD Awards $46.2 Million to Revitalize the U.S. Defense Industrial Base On-Shoring of Advanced Packaging and Assembly

12/22/2023 | U.S. DoD
The Department of Defense announced an award of $46.2 million to GreenSource Fabrication LLC (GreenSource) via the Defense Production Act Investment (DPAI) Program.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/06/2023 | Nolan Johnson, I-Connect007
This week, our must-read picks include the PCB industry monthly report, IPC’s Alison James’ statement to the EU regarding the vitality of our industry, an overview of test and inspection, greenfield fabrication facility design, and the future of advanced packaging and solder.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in