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Real Time with... IPC APEX EXPO 2025: GreenSource's Growth and Future Developments
April 15, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute
Things are looking bright for GreenSource. Michael Gleason shares an update on GreenSource's recent growth and upcoming changes. A recipient of a Defense Production Act Investment Program award, GreenSource is planning for new substrate capabilities. Current investments continue to enhance equipment and sustainability initiatives such as water quality. And their unique collaboration with the University of New Hampshire continues to aid their workforce development, despite recruitment challenges.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
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D Coupon Testing and Data Insights With GreenSource Fabrication
04/17/2024 | Marcy LaRont, PCB007 MagazineMarcy LaRont spoke with Steve Karas of GreenSource Fabrication at the SMTA UHDI conference in March. He presented a case study that GreenSource undertook with a customer on critical via reliability with advanced materials and used the experience to highlight the importance and effectiveness of D coupon testing. He also discussed GreenSource’s approach to data aggregation and a new system they developed to use collected data effectively.
DOD Awards $46.2 Million to Revitalize the U.S. Defense Industrial Base On-Shoring of Advanced Packaging and Assembly
12/22/2023 | U.S. Department of DefenseThe Department of Defense announced an award of $46.2 million to GreenSource Fabrication LLC (GreenSource) via the Defense Production Act Investment (DPAI) Program. The award will enhance existing production capabilities at a manufacturing facility of state-of-the-art integrated circuits (IC) substrate, high-density interconnect (HDI) and ultra-high-density interconnect (UHDI), and advanced packaging.
DOD Awards $46.2 Million to Revitalize the U.S. Defense Industrial Base On-Shoring of Advanced Packaging and Assembly
12/22/2023 | U.S. DoDThe Department of Defense announced an award of $46.2 million to GreenSource Fabrication LLC (GreenSource) via the Defense Production Act Investment (DPAI) Program.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/06/2023 | Nolan Johnson, I-Connect007This week, our must-read picks include the PCB industry monthly report, IPC’s Alison James’ statement to the EU regarding the vitality of our industry, an overview of test and inspection, greenfield fabrication facility design, and the future of advanced packaging and solder.
GreenSource Engineering: An Eye on Design
10/04/2023 | Nolan Johnson, I-Connect007Schweitzer engaged the services of GreenSource Engineering to assist in the initial design of the facility, along with handling automation equipment. Nolan Johnson met with the GreenSource team— Michael Gleason, Marco Mirkovic, James Brown, and Rick Nichols—representing GreenSource Engineering and GreenSource Fabrication (GSF), to better understand their working relationship for the build-out of the new facility in Moscow, Idaho.