Global Citizenship: Together for a Perfect PCB Solution
Smart Automation: Odd-form Assembly—Dedicated Insertion Equipment Matters
Nolan’s Notes: Everyone Has Their Eye on India
ZESTRON Academy Launches 2024 Advanced Packaging & Power Electronics Webinar Series
May 1, 2024 | ZESTRONEstimated reading time: 1 minute
ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges. Designed to address the evolving challenges in semiconductor manufacturing, this comprehensive series of webinars will delve into cutting-edge topics crucial for optimizing processes and enhancing reliability.
Led by Senior Application Engineer Ravi Parthasarathy, ZESTRON's upcoming webinar series promises to be an indispensable resource for professionals in the semiconductor industry. With a focus on addressing the unique challenges and requirements of semiconductor manufacturing, each session will deliver invaluable insights and practical solutions. Recognizing the intricate demands of the semiconductor sector, the webinars will provide tailored content designed to meet the specific needs of industry professionals, from semiconductor fabrication facilities to electronic component manufacturers. Ravi brings a wealth of expertise and experience to the table, with years of hands-on involvement in advanced packing and power electronics cleaning technologies, offering a unique perspective on the industry's evolving landscape and ensuring that participants receive expert guidance backed by real-world insights.
The webinar series will foster an interactive learning environment, encouraging participants to engage with the material and exchange ideas with fellow industry professionals through live Q&A sessions. In an industry where innovation is constant, staying ahead of the latest developments is paramount. ZESTRON's Advanced Packaging & Power Electronics webinar series serves as a platform for continual learning, empowering semiconductor professionals to remain at the forefront of their field.
Webinar Topics Include:
- Optimizing High Bandwidth Memory (HBM) Wafer Surface Treatment: Navigating Cleaning Challenges
- Tackling Flux Residues: Best Practices for Cleaning Power Electronics Components
- Unveiling Defluxing Strategies for High-Density Advanced Packaging with Ultra-Fine Pitch Die on CoWs
- Advancing Reliability in Automotive Power Electronics: Cleaning Strategies and Corrosion Mitigation
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Zhen Ding Drives AI-Powered Digital Transformation
09/12/2025 | Zhen DingDriven by the surging demand for computing power fueled by AI, the semiconductor and PCB industries are forging closer integration, expanding their ecosystems, and pursuing shared growth. PCB has already become another NT$ trillion-dollar industry in Taiwan, growing in tandem with the semiconductor sector.
Zhen Ding Expands PCB into Semiconductors at SEMICON Taiwan 2025; Advantech Drives AI Smart Parks
09/12/2025 | Zhen DingZhen Ding Technology Holding Co., Ltd., a global leader in the PCB industry, returned to exhibit at SEMICON Taiwan 2025. Positioning itself as an industry pioneer in "PCB expanding into semiconductors," the company showcased its latest strategic layout
SkyWater Completes Acquisition of Fab 25, Expanding U.S. Pure-Play Foundry Capacity for Critical Semiconductor Technologies
09/12/2025 | SkyWaterSkyWater Technology, the trusted technology realization partner, announced that it has completed its acquisition of Infineon Technologies AG’s 200 mm semiconductor fab in Austin, Texas (“Fab 25”)
Secure Semiconductor Manufacturing Acquires Full SMT Line from Manncorp
09/11/2025 | ManncorpSecure Semiconductor Manufacturing, LLC (SSM), an American-owned company dedicated to producing secure printed wiring boards and advanced assembly solutions in the MidWest USA, today announced the acquisition of a complete surface mount technology (SMT) line from Manncorp.
MEMS & Imaging Sensors Summit to Spotlight Sensing Revolution for Europe’s Leadership
09/11/2025 | SEMIIndustry experts will gather November 19-20 at the SEMI MEMS & Imaging Sensors Summit 2025 to explore the latest breakthroughs in AI-driven MEMS and imaging optimization, AR/VR technologies, and advanced sensor solutions for critical defence applications.