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IPC APEX EXPO: Some Thoughts About Growth
May 16, 2024 | Dan Feinberg, I-Connect007Estimated reading time: 1 minute
After two and a half days of wandering the aisles at IPC APEX EXPO 2024, for the first time, I almost felt like I was exploring CES. There were so many booths and exhibits that I could describe, but I’d like to focus on the growth and huge value of this event, which has expanded well beyond just the growing and impressive exhibit show floor.
This event has grown from a group of the leading suppliers in the industry of the late 20th-century PCB fabrication industry—mostly focused in the U.S. at that time—to a global trade show that includes extremely impressive exhibits (and a few not-so-impressive ones) exhibiting PCB assembly, fabrication, and design manufacturing equipment; raw materials; process materials and chemicals; software and design tools; and components. These come from contract manufacturers and large suppliers of all sizes. If you attend IPC APEX EXPO, you can explore every segment and anything needed to design and build an electronic device, from the design to the assembled device. I think the next logical step would be to see the completed device shown and marketed at CES or in stores.
This year, many of us who were involved years ago in the dream of IPC having such a show were discussing how this event has grown in ability, complexity, and value over the past quarter-century. There is a lot of pride in how this event has matured. This includes the show floor, the design and fab meetings, the ability of senior management in all segments of the industry to discuss and plan for the future, and the valuable assets provided to assist those just entering the industry.
To read this entire article, which appeared in the 2024 issue of Show & Tell Magazine, click here.
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
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