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J.A.M.E.S. Explores the Future of Additive Manufactured Electronics

02/18/2025 | Marcy LaRont, I-Connect007
Andreas Salomon is chief scientist at J.A.M.E.S, a joint venture of Nano Dimension and HENSOLD. In this interview he discusses the evolving landscape of additively manufactured electronics, highlighting the integration of cutting-edge technologies, such as micro-dispensing and ink jetting. These technologies enhance capabilities in signal integrity and miniaturization. He also talks about the importance of sustainability, the need for standardized testing, and collaboration among industry leaders that will drive innovation and transform the future of electronics manufacturing through IPC’s standards development.

Rogers Announces Addition of Woon Keat Moh to Board of Directors

12/23/2024 | Rogers Corporation
Rogers Corporation announced that Woon Keat Moh ("Moh") has been appointed as an independent member of the Company’s Board of Directors, effective January 1, 2025. Following this change, the Board will be composed of nine members, eight of whom are independent.

Nano Dimension’s Additive Electronics Product Line - Essemtec - Received a Global Technology Award

12/11/2024 | Nano Dimension
Nano Dimension Ltd, a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printing solutions, announced that its Tarantula Underfill system from its Essemtec product lines received the Global Technology Award for Innovation at the SMTA International 2024 Show in Chicago, Illinois.

iSQUARED Expands Specialized Material Offerings Validated for Stratasys 3D Printers

12/03/2024 | BUSINESS WIRE
iSQUARED, a wholly-owned subsidiary of Stratasys, announced today an expansion of its portfolio of materials validated for use in Stratasys 3D printers, alongside the launch of a marketplace for pre-owned Stratasys machines.

Scrutinizing Solder Printing

09/10/2024 | Nolan Johnson, I-Connect007
As members of the technical staff at Indium, Adam Murling, technical manager, and Ron Lasky, senior technologist and professor at Dartmouth University, know their way around metallurgy and solder formulation. I corralled them for a conversation on solder application techniques from the solder’s perspective and their insights did not disappoint.
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