-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
IPC Releases Newest List of Standards Updates, Revisions
June 3, 2024 | IPCEstimated reading time: Less than a minute
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q2.
IPC-7711/21D
Rework, Modification and Repair of Electronic Assemblies
IPC-7711/21D provides guidance on procedures for rework, repair, and modification of printed board and cable or wire harness assemblies. IPC-7711/21D provides the requirements, tools, and materials to be used in the rework, repair, and modification of electronic products and for cable or wire harness assemblies.
IPC-2221C
Generic Standard on Printed Board Design
IPC-2221C establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures, including PC card form factors. The organic materials may be homogeneous, reinforced, or used in combination with organic materials; the interconnections may be single, double, or multilayered.
To find out the rest of the newest standards, which were published in the Spring 2024 issue of IPC Community, click here.
Suggested Items
The ICAPE Group Announces the Launch of Its E-Shop at Electronica
10/31/2024 | BUSINESS WIREThe ICAPE Group, a global technology distributor of printed circuit boards (PCB) and custom-made electromechanical parts, today announced its participation at the 2024 edition of Electronica, where it will present the ICAPE Shop, its new online purchasing platform.
2024 IPC CEMAC China Electronics Manufacturing Annual Conference Focuses on the Electronics Industry’s Future
10/24/2024 | IPCThe 2024 IPC CEMAC China Electronics Manufacturing Annual Conference, co-organized by IPC and the Shanghai Pudong New Area Quality Technology Association, kicked off with a grand opening ceremony in Shanghai. Themed "Making Your Imagination Reality," the event has brought together leaders, technical experts, and corporate representatives from the global electronics manufacturing industry to explore future trends and opportunities.
Counterfeit Concerns: Navigating the Risks
10/23/2024 | Nolan Johnson, SMT007 MagazineNolan Johnson meets with Diganta Das, PhD, and Michael Azarian, PhD, research scientists at the CALCE Electronic Products and Systems Center at the University of Maryland, to discuss the increasing issue of counterfeiting in the electronics and assembly industry. Diganta and Michael highlight the need for robust detection methods and standards to mitigate risks, specifically referencing SAE AS6171 for inspection and AS5553 for counterfeit mitigation. They cover real-world cases, like counterfeit network equipment scandals to relatively simple issues of consumer electronics accessories to illustrate the complexity of the issue and debate the philosophical implications of labeling products that contain a few minor counterfeit components as “counterfeit.”
SEMICON Japan 2024 to Expand Scope with Spotlight on Advanced Design Innovation
10/23/2024 | SEMISEMICON Japan 2024, the largest gathering of leaders from the microelectronics manufacturing supply chain in Japan, will assemble more than 1,000 exhibitors showcasing semiconductor solutions for smart technologies from Dec. 11-13 at Tokyo Big Sight.
Fall 2024 Issue of IPC Community Now Available
10/14/2024 | IPC Community Editorial TeamThere’s so much happening at IPC, so be sure to open the latest issue of IPC Community, brimming with must-read features on members of the electronics industry who are making a difference in their own unique way. Just for starters, our member profiles feature Virginia-based Weidmuller, a heart-warming story from E-Tron, and you’ll discover how the owners of Out of the Box Manufacturing are successfully tackling workforce talent challenges.