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IPC Releases Newest List of Standards Updates, Revisions
June 3, 2024 | IPCEstimated reading time: Less than a minute

Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q2.
IPC-7711/21D
Rework, Modification and Repair of Electronic Assemblies
IPC-7711/21D provides guidance on procedures for rework, repair, and modification of printed board and cable or wire harness assemblies. IPC-7711/21D provides the requirements, tools, and materials to be used in the rework, repair, and modification of electronic products and for cable or wire harness assemblies.
IPC-2221C
Generic Standard on Printed Board Design
IPC-2221C establishes the generic requirements for the design of organic printed boards and other forms of component mounting or interconnecting structures, including PC card form factors. The organic materials may be homogeneous, reinforced, or used in combination with organic materials; the interconnections may be single, double, or multilayered.
To find out the rest of the newest standards, which were published in the Spring 2024 issue of IPC Community, click here.
Suggested Items
New IPC VP Joe Schneider Building Stronger Focus on U.S., Canada
06/19/2025 | Marcy LaRont, I-Connect007IPC has hired Joe Schneider as a vice president to strengthen its regional focus and address the specific needs in the U.S. and Canada. Joe brings a rich background in OEM and contract manufacturing, including with industry giants like Siemens and Abbott Laboratories. In this interview, he shares his vision for the region, which emphasizes workforce development and supply chain challenges.
Standards: The Roadmap for Your Ideal Data Package
05/29/2025 | Andy Shaughnessy, Design007 MagazineIn this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.
LSI ADL Technology Leverages IPC Membership for Growth, Training, and Industry Leadership
05/28/2025 | Michelle Te, IPC CommunityWhether attending the EMS Leadership Summit at IPC APEX EXPO, or subscribing to workforce training, LSI ADL Technology has noted several positive changes directly related to its IPC membership. “Collaboration, brainstorming, and sharing best practices have been the most important aspects of our partnership with IPC,” says Jonathan Verity, assistant general manager at LSI ADL Technology.
TT Electronics' Cleveland Ohio Facility Re-Certified to Aerospace and Defence Standards AS9100 and Nadcap
05/23/2025 | TT ElectronicsTT Electronics has successfully completed recertification of the Cleveland facility to AS9100 and Nadcap standards. This milestone underscores the company’s unwavering dedication to quality in manufacturing for the aerospace and defence sectors, a commitment proudly upheld for more than 15 years.
IPC-CFX, 2.0: Expanding the Digital Backbone of Electronics Manufacturing
05/21/2025 | Chris Jorgensen, IPCSince its initial release in March 2019, IPC Connected Factory Exchange (CFX), the global standard for plug-and-play, machine-to-machine, and machine-to-system communication serving as the backbone for digital manufacturing, has seen continuous enhancement through multiple version updates. In 2024, the standard matured as adoption spread, with a global committee of EMS, OEM, machine vendors, and software solution providers twice releasing version updates to build on the standard's base framework and enhance its usability in industry.