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ViTrox Showcases Cutting-Edge VisionXpert Smart Code Readers at SMTA Penang 2024
September 17, 2024 | ViTroxEstimated reading time: 1 minute
ViTrox, which aims to be the World’s Most Trusted Technology Company, is excited to announce its participation in the SMTA Penang at Table #37 in the AC Hotel, Penang on 25-26 September 2024.
ViTrox will showcase its core technologies that are driving the future of smart manufacturing. Our V310i Advanced 3D Solder Paste Inspection (SPI), V510i Advanced 3D Optical Inspection (AOI), V810i Advanced 3D X-ray Inspection (AXI), V9i Advanced Robotic Vision (ARV) and Industry 4.0 Manufacturing Intelligence Solutions (V-ONE) are now renowned for their ability to enhance inspection accuracy, efficiency and connectivity across production lines.
Our experts will be onsite to provide insights on these advanced PCB SMT inspection solutions. Visit our booth (Table #37) to meet with our experts on how our advanced technologies can optimise your production processes.
In addition, we are excited to showcase the VisionXpert Smart Code Reader (XS Series), designed to revolutionise the manufacturing process with its AI-driven capabilities. This innovative solution optimises code reading across various environments by excelling in decoding complex codes, deep learning and adaptive auto-tuning. These advanced features significantly enhance inspection accuracy and efficiency, minimising errors and maximising throughput, making VisionXpert an essential tool for ensuring the reliability of production lines.
Furthermore, we are also thrilled to announce that Mr. Calvin Anak Rigar, will be delivering a technical presentation titled ‘The Road to Manufacturing Process Self-Healing with A.I.’ at 2:00 PM on 26th September, delving into the evolution of Smart Manufacturing driven by Artificial Intelligence (A.I.). Attendees will gain insights into how automation in manufacturing has progressed beyond equipment-level processes and closed-loop Machine-to-Machine (M2M) communications. Through strategic architecture and environment planning, the implementation of AI can enable the creation of self-healing production lines that automatically optimise processes. Additionally, the conventional method of Statistical Process Control (SPC) data analysis can be automated and conducted in real-time, leading to more efficient process optimisation.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Nvidia’s Blackwell Chips Made in Arizona Still Head to Taiwan for Final Assembly
10/27/2025 | I-Connect007 Editorial TeamNvidia has begun production of its next-generation Blackwell GPUs in the United States, but the company still depends heavily on Taiwan to complete the process, The Register reported.
TSMC Fast-Tracks Advanced Chip Technology at Arizona Plant Amid Rising AI Demand
10/27/2025 | I-Connect007 Editorial TeamTSMC said earlier this month that it’s speeding up the rollout of its most advanced chip technology in the US because of rising AI product demand and Intel’s growing competition, The Register reported.
YES Selected to Deliver Full Portfolio of Advanced Packaging Tools for Glass Panel AI and HPC Applications
10/24/2025 | BUSINESS WIREYield Engineering Systems (YES), a leading provider of advanced process equipment for AI and high-performance computing (HPC) semiconductor applications, announced that it has received multiple tool orders from a global leader in AI infrastructure solutions.
TSMC Reports Third Quarter EPS of NT$17.44
10/22/2025 | TSMCTSMC announced consolidated revenue of NT$989.92 billion, net income of NT$452.30 billion, and diluted earnings per share of NT$17.44 (US$2.92 per ADR unit) for the third quarter ended September 30, 2025.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
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