Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
iNEMI Packaging Tech Topic Webinar: Packaging Interconnect Material Technology Series
September 19, 2024 | iNEMIEstimated reading time: 1 minute
The International Electronics Manufacturing Initiative (iNEMI) continues its Packaging Interconnect Material Technology Series with a webinar on Transient Liquid Phase (TLP) Bonding for High-Temperature Soldering Processes. This session, scheduled for Tuesday, September 24, 2024, will feature guest speaker Dr. Kazuhiro Nogita from the Nihon Superior Centre for the Manufacture of Electronic Materials.
With the increasing demand for high-power devices and applications requiring high-temperature interconnections, this webinar provides an essential overview of how TLP bonding can be utilized to enhance the reliability of SnCu solder systems. The discussion will focus on advances in lead-free Sn-based alloy systems, particularly tin-copper (SnCu), widely recognized for its cost-effectiveness, good fluidity, and low defect rates.
Dr. Nogita will draw from his extensive research to explain how TLP bonding can address the challenges posed by high-power density and miniaturization in electronics. This process makes it possible to achieve strong and reliable connections in demanding high-temperature environments.
About the Speaker
Dr. Kazuhiro Nogita is the founding director of the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM). He is also project manager of the University of Queensland – Kyushu University Oceania project (UQ-KU project) and Deputy Chair of the International Development and Engagement Committee at the School of Mechanical and Mining Engineering. His research is in three major areas: lead-free solders and interconnect materials, energy materials such as hydrogen-storage alloys, and structural and coating alloy development.
Registration:
This webinar is open to industry; advance registration is required, visit iNEMI's website.
Tuesday, September 24, 2024
10:00-11:00 a.m. JST (Japan)
9:00-10:00 p.m. EDT (Americas) on Monday, September 23
Share on:
Suggested Items
Global Semiconductor Sales Increase 23.2% in Q3 2024 YoY; QoQ Sales Up 10.7%
11/06/2024 | SIAThe Semiconductor Industry Association (SIA) today announced global semiconductor sales were $166.0 billion for the third quarter of 2024, an increase of 23.2% compared to the third quarter of 2023 and 10.7% more than the second quarter of 2024.
North American EMS Industry Shipments Up 10.3% in September
10/29/2024 | IPCIPC announced the September 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Shipments Down 24.1% in September
10/29/2024 | IPCIPC announced the September 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.08.
HANZA's Principal Owner Increases its Holding
10/14/2024 | HANZAHANZA’s main shareholder Färna Invest AB, owned by Gerald Engström, has purchased 380,000 shares in HANZA AB during September and owns 9,980,000 shares in the company at the end of September, corresponding to 22.86%. This is according to data as of 2024-09-30 from Euroclear.
ODMs Slow Stocking; 4Q24 MLCC Shipments Expected to Decline by 3.6%
10/08/2024 | TrendForceTrendForce’s latest findings show that recent economic data points to a steady cooling of inflation in the US market, prompting the Federal Reserve to cut interest rates by 50 basis points in September to prevent a potential economic slowdown or recession.