Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

KYZEN to Feature Aqueous Cleaner AQUANOX A4618 at SMTA Expo and Tech Forum

01/23/2025 | KYZEN'
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Austin Expo and Tech Forum scheduled to take place Thursday, February 6 at the Travis County Exhibition Center in Austin, Texas.

Indium to Showcase Durafuse Solder Technology at NEPCON Japan

01/21/2025 | Indium Corporation
As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is looking forward to featuring its innovative Durafuse® solder technology at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.

The Chemical Connection: Better Fabs Attract a Better Workforce

01/23/2025 | Don Ball -- Column: The Chemical Connection
Workforce problems are almost as great an issue in PCB manufacturing today as the product quality and reliability of the increasingly complex circuit boards now in demand. I believe they are directly related. A quality workforce makes it easier to produce a quality product. Unfortunately, as an industry, we have not done a good job of attracting quality young people for today’s production requirements.

Elementary Mr. Watson: The Road Ahead—Advances in PCB Design Technology

01/23/2025 | John Watson -- Column: Elementary, Mr. Watson
This year introduces a new generational group, likely to be dubbed Generation Beta, since Generation Alpha was born between 2010 and 2024 and is considered the first generation born in the 21st century. Generation Alpha grew up in a world dominated by smartphones, artificial intelligence, and rapid technological advancements. It is anticipated that Generation Beta will live to see the 22nd century. 

All Flex Solutions Upgrades Lamination Layup

01/17/2025 | All Flex Solutions
All Flex Solutions has invested in Ulrich Rotte lamination layup stations in their rigid flex layup area. The Ulrich Rotte stations automate the layup process by handling the lamination plates, which are heavy, and sequencing the layup process for the operators.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in