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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
March 7, 2025 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes

It’s been a busy week. My must-reads include articles and news items on global trends and challenges, groundbreaking technology, the hunt for the elusive young PCB designers, and some personnel changes. We also have a great column on the value of following up and keeping promises. We’re all guilty of “dropping the ball” from time to time, aren’t we? So, how do you recover?
IPC APEX EXPO takes place in Anaheim, California, March 18-20, and we’ll be there from ribbon-cutting through the final announcement telling everyone that the show is closed. We’ll be bringing you Real Time with… video interviews with the movers and shakers in PCB design, fabrication, assembly, and test. I’ll be glad to get out of Atlanta—it’s freezing here.
If you’re at the IPC show, stop by our booth and say hello. In the meantime, have a good weekend.
IMAPS’ Annual Conference Opener in Phoenix ‘Blew My Mind’
Published March 5
PCB007 Editor Marcy LaRont brings us this review of the first day’s events at the IMAPS Device Packaging Conference in Phoenix this week. As she explains, there was a lot of attention paid to AI and advanced packaging substrates, including glass. I understand the appeal of glass at the packaging level. I’ve heard some PCB fabricators discuss using glass; has anyone on the PCB side ever utilized glass?
UHDI Fundamentals: UHDI Advances Neurotechnology
Published March 5
If you’ve been following Anaya Vardya’s UHDI series, you’re aware that his new technology is a real game-changer. In this installment, Anaya explains how UHDI figures into the development of neurotechnology, especially brain-computer interfaces (BCI). It’s a brave new world for UHDI, and the innovation is only getting started.
Summit Interconnect Announces Key Executive Appointments: Sean Patterson Named CTO, Michael Norman Joins as President and COO
Published March 6
Summit Interconnect has new leadership now, with COO Sean Patterson becoming the company’s first CTO. Michael Norman joins Summit from Raytheon, becoming president and COO. Shane Whiteside will continue as CEO and chairman of the board.
It’s Only Common Sense: Follow Through and Keep Your Promises
Published March 3
Dan Beaulieu really nails it this week: We work in a blizzard of emails and texts, so following up is a real necessity. There’s really no excuse for failing to follow up, and we’re all guilty of this at one time or another. But we all know which of our friends, customers, and suppliers are the most likely to follow up, and they’re the ones we tend to want to deal with. Dan says, “Following through on promises isn’t a common trait.” I’d like to disagree, but he may be right. Check it out.
Recruiting the Next Generation of PCB Designers at Garmin
Published March 6
It’s no secret that we’re running out of PCB designers and design engineers. There are open PCB design jobs around the globe, and there aren’t enough designers to fill these jobs. In this interview, Garmin’s design engineering manager, LB Yates, explains the company’s plans to recruit and train the next generation of PCB designers.
Suggested Items
Prague PEDC: Call for Abstracts Deadline July 31
07/16/2025 | an-European Electronics Design Conference (PEDC)The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline is July 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
Staying—and Excelling—in Their Lane
07/16/2025 | Nolan Johnson, SMT007 MagazineMichael Seltzer, chief commercial officer at Zentech Manufacturing, helps define his company’s niche and why it has mattered to them over nearly three decades. Should a company shift with the markets or stay true to its mission? Find out how Michael has helped the company truly understand its vision.
Flexible Circuit Technologies Welcomes Regional Business Development Manager Derek Rossberg
07/15/2025 | Flexible Circuit TechnologiesFlexible Circuit Technologies a Minnesota-based flexible circuit and advanced electronics contract manufacturer, welcomes Derek Rossberg as Regional Business Development Manager.
KONIG Launches KP400: Advanced 3D Digital Conformal Coating System for High-Density Electronics
07/15/2025 | KONIGKONIG, a leader in electronic packaging protection solutions, is proud to announce the launch of the KP400 3D Digital Packaging Solution—a breakthrough conformal coating system that brings new levels of precision, speed, and material efficiency to electronics manufacturing.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.