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SIA Commends Finalization of CHIPS Incentives for TSMC

11/18/2024 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of the agreement to allocate incentives to TSMC under the CHIPS and Science Act. The agreement between TSMC and the U.S. Department of Commerce will support the expansion of TSMC’s semiconductor fabs in Arizona.

Keysight Providing Software to Enable Researchers through the Microelectronics Commons

11/15/2024 | Keysight Technologies
Keysight Technologies, Inc. announced it has reached an agreement to provide its electronic design automation (EDA) software to six of the eight hubs participating in the Microelectronics Commons (Commons).

ITW EAE Expands Partnership with Etek Europe to Represent Despatch Products in the UK and Ireland

11/13/2024 | ITW EAE
ITW EAE, announces a new partnership agreement with Etek Europe to further expand its representation and distribution network. Under this agreement, Etek Europe will represent Despatch products in the United Kingdom and Ireland. 

Inventec Performance Chemicals and Nano-Join are Teaming Up to Deliver Sintering Solutions

11/08/2024 | SMTA
With great excitement we announce to have signed a license agreement with NANO-JOIN GmbH to use their sintering technology and integrate it into our ECORELTM SINTEC product line.

Teledyne to Acquire Micropac

11/04/2024 | BUSINESS WIRE
Teledyne Technologies Incorporated and Micropac Industries, Inc. jointly announced that they have entered into a definitive merger agreement that provides for the merger of Micropac with a wholly-owned subsidiary of Teledyne.
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