The Marketing Minute: Go Big or Go Home—Long-form Content Is Your Brand’s Best Friend
Schmoll: Decades of Technology Evolution
It’s Only Common Sense: The Danger of Overthinking
PCB007 Magazine October 2024: Alternate Metallization Processes
October 16, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop. In the October 2024 issue of PCB007 Magazine, we examine alternate metallization methods, including MacDermid Alpha’s graphite technology and Uyemura’s RAIG technology.
In addition, John Johnson of American Standard Circuits discusses liquid metal ink as a process technology alternative. Dyconex talks about alternative metal elements from the standpoint of R&D and explains sputtering technology. And we revisit Mike Carano’s comprehensive overview of direct metallization technology from our July 2024 issue of PCB007 Magazine.
For all of that and more, get onboard for destination metallization.
Share on:
Suggested Items
Foxconn Chairman Young Liu to Deliver Keynote at COMPUTEX 2025
03/28/2025 | PRNewswireTAITRA (Taiwan External Trade Development Council), announced that Young Liu, Chairman of Hon Hai Technology Group (Foxconn), is invited to be the speaker at COMPUTEX 2025 Keynote, sharing his vision on three intelligent platforms driving industry transformation and the role of robotics in factories of the future.
MVTec, Pepperl+Fuchs Enter into Technology Partnership
03/27/2025 | MVTecMVTec Software GmbH and Pepperl+Fuchs are stepping up their technological collaboration in the field of machine vision. As part of this, Pepperl+Fuchs joined the MVTec Technology Partner program at the beginning of 2025.
DuPont Announces Board of Directors for the Planned Independent Electronics Company
03/27/2025 | PRNewswireDuPont announced the members of the future board of directors for the independent Electronics public company that will be created following its intended spin-off from DuPont.
HARTING 3D-Circuits Leads 3D-MID Innovation: Transforming Consumer Electronics with Advanced Technology
03/27/2025 | PRNewswireThe consumer electronics industry is experiencing a remarkable transformation, propelled by rapid technological advancements and an increasing demand for compact, efficient, and multifunctional devices. Central to this evolution is 3D-MID (Three-Dimensional Mechatronic Integrated Devices) technology, which redefines design standards and drives innovation.
Point2 Technology, Sumitomo Electric Industries New Partnership
03/26/2025 | Point2 TechnologyPoint2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Sumitomo Electric Industries, Ltd. (SEI), a global leader in high-speed communication systems, announced the signing of a Memorandum of Understanding (MOU) to collaborate on the development of SEI’s next-generation 25G optical transceiver modules.