-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Saki Introduces Advanced X-Ray Inspection System for Next-Generation Miniaturized and Slim Power Modules
December 11, 2024 | Saki Corp.Estimated reading time: 2 minutes
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce the launch of the 3Xi-M200v3, the latest addition to its acclaimed 3Xi-M200 AXI series. This advanced X-ray automated inspection system is designed to ensure the highest manufacturing quality of increasingly compact and slim power modules. The 3XI-M200v3 delivers high-speed and high-precision inspections of power modules equipped with heat sinks. Featuring a large X-ray camera and optimized image processing algorithms, the 3Xi-M200v3 achieves three times the resolution of its predecessors while reducing inspection times by up to 50%. This makes it the ideal solution for manufacturing processes for compact, thin power modules, which are increasingly demanded for applications such as electric vehicles (EVs) and data centers.
Driven by global decarbonization efforts, EVs and data center applications increasingly demand greater energy efficiency, fueling the rapid expansion of power module production. These applications demand exceptional manufacturing quality and safety within confined spaces, alongside improved cooling and energy efficiency. Consequently, there is a strong push for compact and slim designs in power modules. To meet these demands, manufacturers are adopting advanced technologies like 3D packaging and double-sided cooling in power module design. However, the trend toward smaller, thinner power modules presents challenges for X-ray inspection, such as achieving sufficient contrast and minimizing interference from overlapping layers.
The new 3Xi-M200v3 rises to the challenge with its large, highly sensitive detector, which captures high-contrast images of even ultra-thin materials. Enhanced CT computation capabilities deliver threefold resolution improvements while cutting inspection times in half compared to previous models. These advancements allow precise separation of multi-layer components within complex power modules, delivering high-resolution images for faster and more accurate inspections.
The 3Xi-M200v3 is designed to optimize overall production efficiency. It features dedicated operator judgment software tailored for power module inspection, streamlining final inspection processes. Fully compliant with the SEMI SECS/GEM standards, the system supports automation and workforce reduction initiatives, aligning with the goals of smart factory implementation.
“We are proud to introduce the 3Xi-M200v3, a testament to Saki’s relentless pursuit of innovation,” said Norihiro Koike, President and CEO of Saki Corporation. “As the manufacturing landscape evolves, our customers face increasingly complex challenges, including the demand for smaller, more efficient, and highly reliable power modules. The 3Xi-M200v3 embodies our commitment to providing cutting-edge solutions that not only enhance product quality but also improve operational efficiency and drive sustainability across industries. At Saki, we see ourselves not just as technology innovators but as partners in progress, enabling our customers to lead in their respective markets and contribute to a more sustainable future.”
Suggested Items
AI Helps Build Smarter, More Resilient Power Grids
05/16/2025 | BUSINESS WIREAs society’s reliance on electricity deepens, artificial intelligence (AI) is reshaping how we manage power grids and optimize energy sources.
Corning Collaborates with Broadcom to Accelerate AI Data Center Processing Capacity
05/14/2025 | BUSINESS WIRECorning Incorporated, a world leader in glass science and optical physics, today announced a collaboration with Broadcom Incorporated, a leading supplier in the semiconductor field, on a co-packaged optics (CPO) infrastructure that will significantly increase processing capacity within data centers.
TT Electronics Secures £50 Million in New Contract Awards for Classified U.S. DoD Defense Programs
05/12/2025 | TT ElectronicsTT Electronics, a leading provider of global manufacturing solutions and engineered technologies, announced today that it has been awarded significant new contracts totalling over £50 million to support classified U.S. Department of Defense (DoD) programs.
LITEON Technology Reports Consolidated April Sales of NT$13.4 Billion Up 27% YoY
05/09/2025 | LITEON TechnologyLITEON Technology reported its April consolidated revenue of NT$13.4 billion. Thanks to the growth from power management in cloud computing, advanced server, and networking, the revenue is up 27% YoY.
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.