SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition

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The SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition. With more than 40 years of experience in horizontal electroless Cu processes for high-end PCB and SLP applications, SCHMID combines this legacy with extensive know-how from the advanced packaging industry.

The InfinityLine H+ overcomes the disadvantages of widely used vertical batch processes by introducing newly developed horizontal inline process modules, add-on processes, and an optimized transport system. This latest advancement underscores SCHMID’s dedication to delivering cutting-edge solutions tailored to the evolving needs of manufacturers.

The upgraded InfinityLine H+ achieves highly uniform Cu deposition and features innovative enhancements, including an ozone module for pristine surface preparation, an advanced electroless copper module design, and a revolutionary three-point transport system that eliminates contact with active areas. These innovations empower manufacturers to achieve unprecedented yields in metallization processes while unlocking new technological capabilities.

Each panel is automatically treated under identical process conditions using highly efficient flood boxes that precisely target treatment areas—a significant advantage over traditional vertical basket systems. The horizontal process enhances the uniformity of copper thickness and provides superior performance in rinsing and drying substrate panels. Combined with the state-of-the-art SCHMID Watch 3.0 HMI and process control system, which leverages the decentralized H+ bus system for active and passive components, the InfinityLine H+ offers a smarter and more sustainable production solution.

"The new InfinityLine H+ Electroless Cu exemplifies our steadfast commitment to innovation," said Laurent Nicolet, Vice President of Business Units Electronics. "Compared to vertical batch applications, we achieve more uniform Cu deposition with high adhesion, even on low- roughness ABF materials. By reinventing key system components, the horizontal processing advantages are now accessible to the substrate industry. Together with our proven H+ modular platform, this system offers a more advanced, smarter, and sustainable solution for advanced substrate production, perfectly aligning with current and future manufacturing needs."

Key Features of the Updated InfinityLine H+

1. Ozone Module for High-Adhesion Depositions

• Integrated Gas and Wet Module Design: Streamlined and user-friendly for optimized operation.
• Direct Ozone Application: Delivers ozone precisely where needed, ensuring surface cleanliness with heavily ozone-loaded water treatment.
• Organic Contamination Removal: Efficiently eliminates organic residues without chemically altering or damaging substrate surfaces.

2. Three-Point Tenting Transport System for Handling a Wide Range of Materials

• Gentle Floating Centering: Maintains precise substrate alignment within immersion zones while protecting surfaces.
• No Centering Station Required: Prevents surface damage, enhancing product quality.
• Contactless Transport: Employs newly developed rollers alongside high- performance tenting rollers for safe and controlled substrate movement, eliminating uncontrolled copper deposition.

3.     Enhanced Electroless Copper Module for Highly Uniform and Particle-Free Cu Deposition

• Vacuum-Formed Tank Base: Allows for easy cleaning, efficient draining, and eliminates dead spots or chemical deposits.
• Optimized Bath Dynamics: Air injection in tank corners prevents unwanted copper deposits, even in stand-by mode, while reduced bath volumes support faster startups.
• Advanced Dosing and Flow Monitoring: Ultrasonic flow meters, precise dosing mechanisms, and adjustable flood boxes ensure high process stability and reduced chemical consumption.
• Complete Accessibility: Enhanced design simplifies maintenance and ensures efficient operation.
• Improved Draining Mechanism: Prevents unintended plating and facilitates seamless chemical flow.

The upgraded InfinityLine H+ Electroless Cu is designed to meet the needs of industries utilizing SAP and mSAP processes, addressing the growing demand for advanced package applications with superior efficiency and reliability.