Beyond Design: Radiation and Interference Coupling
Elementary, Mr. Watson: Design Data Packages—Circle of Concern or Circle of Influence?
Fresh PCB Concepts: The Power of a Lunch & Learn for PCB Professionals
Are Our Stackup Rules No Longer Valid?
December 19, 2024 | Cherie Litson, EPTAC MIT CID/CID+Estimated reading time: 1 minute
Are the stackup rules we used to follow no longer valid? It depends on what you’re designing. Electrical rules change depending on your circuit. Fabrication rules change depending on which fabricator you’re working with. Today, we just have more options, and sometimes, cost is a bigger rule than anything else.
If you search online for information about layer stackups, trace widths, and hole sizes in PCBs, you’ll find a variety of resources. The trick is to first define your electrical and mechanical requirements, then work with your fabricator to find the savings (i.e., profits) for both the customer and fabricator.
So, how do you navigate all the rules? First, keep learning. Get certified through the CID and CID+ exams. Go to conferences such as IPC APEX EXPO, SMTAI, and PCB West. Stay up to date through trade publications, such as Design007 and PCB007 magazines.
If cost is not an issue, and you have an in-house fabrication and assembly shop, you can experiment with all kinds of options. Just be sure to research the physics so you don’t hurt yourself or others.
If cost is a factor (as it is for most of us) and you are sending the design out to find the lowest cost for fab and assembly, you may need to follow the guidelines a bit more diligently. You can still be creative but understand the tradeoffs for what you want to do. Work with the fabricator(s) you select and find out what’s possible within your budget. Use the IPC-1730 and IPC-1720 specifications to be sure you’ve asked the fabricator and assembler all the right questions. The things that are called out are somewhat customizable per fabricator, and using these specs will help you get consistent answers and fabrication price quotes.
Hole sizes and aspect ratios, component pin spacing, and product sizes are getting smaller all the time. How can we navigate the demands of these conditions with the existing manufacturing processes that exist out there?
To read this entire article, which appeared in the December 2024 issue of Design007 Magazine, click here.
Share on:
Suggested Items
Electronics Industry Demand Holds Steady Amid Tariff Turbulence
05/22/2025 | IPCElectronics manufacturers are bracing for higher costs as profit pressures deepen according to IPC’s May Sentiment of the Global Electronics Manufacturing Supply Chain Report.
LitePoint, Pegatron 5G Successfully Launch Volume Manufacturing of 5G O-RAN Radio Units to Power Private 5G Networks
05/21/2025 | BUSINESS WIRELitePoint, a leading provider of wireless test solutions, and Pegatron 5G, a leading provider of end-to-end 5G product solutions, have jointly announced a milestone in their collaboration; the start of high-volume manufacturing for 5G O-RAN radio units.
Fresh PCB Concepts: The Power of a Lunch & Learn for PCB Professionals
05/15/2025 | Team NCAB -- Column: Fresh PCB ConceptsIn the electronics industry, innovation isn’t simply a competitive edge, it’s a survival strategy. For those working in printed circuit board (PCB) design, engineering, procurement, and quality control, staying informed and connected is key to creating high-performance, cost-effective, and manufacturable products. Enter the Lunch & Learn—a simple yet highly effective format for professional development offering technical insights in short, informal sessions (served with lunch).
Localized Automation Becomes a Tariff Storm Safe Haven, but U.S. Smart Factory Build-Out Costs Far Exceed China’s
05/09/2025 | TrendForceTrendForce’s latest “Human-Machine Technology Report” points out that although the 90-day delay on the U.S. reciprocal tariffs announced by the Trump administration in early April 2025 offers temporary relief, it has already triggered lasting shifts in global manufacturing and supply chain strategies.
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.