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US Marine Corps, L3Harris Launch First Long-Range Precision Fire in Training Range Demonstration

02/18/2025 | L3 Technologies
The U.S. Marine Corps successfully demonstrated an L3Harris Technologies (NYSE: LHX) solution for long-range precision fires from a vertical takeoff and landing (VTOL) platform using an AH-1Z helicopter at Yuma Proving Grounds, Arizona. This demonstration marks the first successful engagement of a target from a VTOL platform at previously untouchable ranges.

RTX's Raytheon Completes 10 Subsystem Demonstrations for U.S. Army's Next-Generation Short-Range Interceptor Program

02/18/2025 | RTX
Raytheon, an RTX business, announced a series of 10 successful subsystem demonstrations for the U.S. Army's Next-Generation Short-Range Interceptor (NGSRI), which will eventually replace the Stinger® surface-to-air missile.

Siemens to Accelerate Customer Time to Market with Advanced Silicon IP Through New Alphawave Semi Partnership

02/12/2025 | Siemens
Siemens Digital Industries Software today announced that it has signed an exclusive OEM agreement for its EDA business to bring Alphawave Semi’s portfolio of high-speed interconnect silicon IP to market through its sales channel.

Strategic Materials Conference 2025 to Highlight the New Era of Materials Innovation

02/12/2025 | SEMI
With advanced materials as a critical enabler of semiconductor growth applications, the Strategic Materials Conference (SMC) 2025 will gather top executives and technology leaders from the semiconductor manufacturing industry for exclusive insights into the latest advancements in materials innovation.

LQDX, Arizona State University Sign Semiconductor Packaging Collaboration Agreement

02/11/2025 | LQDX
LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that it has signed a formal agreement with Arizona State University (ASU) to further its partnership which began in 2024, focused on advanced IC-substrates, Fan Out Wafer Level Packaging (FOWLP) and glass core metallization, as enabled by its Liquid Metal Ink (LMI®) technology.
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