Learning With Leo: What Is the Cost of Quality Brought About by Training?
Nolan’s Notes: A Tribute to Iola—and Automation
Knocking Down the Bone Pile: Solderability Test Methods, Myths, and Realities
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
October 31, 2025 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest.
Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
In our podcast, On the Line with…, American Standard Circuits’ John Johnson drops a discussion on the role of vias in UHDI manufacturing. Marcy LaRont reports on SMTA International, and Global Electronics Association’s advocacy expert Chris Mitchell provides his analysis of the current global trade environment and its effects on electronics manufacturing.
Quick note: We’re releasing our “Spotlight on Mexico” issue of SMT007 Magazine next Monday, and it’s one to read if Mexico is at all part of your supply chain. Spoiler alert: Your supply chain probably moves through Mexico more than you know. Be sure to check out the November issue. (If you speak Spanish, you’re in for a treat!)
TSMC Fast-Tracks Advanced Chip Technology at Arizona Plant Amid Rising AI Demand
Published October 27
AI product demand is so strong that TSMC is accelerating the rollout of its most advanced chip fab technology at its Arizona facilities. Will this be 3-nanometer, or will TSMC leapfrog to 2-nanometer? That remains to be seen.
Nvidia’s Blackwell Chips Made in Arizona Still Head to Taiwan for Final Assembly
Published October 27
Despite the domestic production, Nvidia’s top-tier GPUs will still travel to Taiwan for advanced packaging. This is true for most semiconductors produced in the U.S. Amkor Technology’s advanced packaging plant in Arizona won’t start operating until 2027 or 2028.
On the Line With… Ultra HDI Podcast—Episode 7: “Solder Mask: Beyond the Traces,” Now Available
Published October 29
John Johnson explains why solder mask application is one of the most pivotal—and often underestimated—steps influencing UHDI performance and reliability. Fabricators must fine-tune their processes to fully realize UHDI’s potential and achieve lasting success in ultra-fine feature manufacturing, and John discusses how.
A New Era for Global Trade and Electronics
Published October 28, 2025
Chris Mitchell, VP of global government relations at the Global Electronics Association, discusses the effects of what appears to be a fragmentation of the long-standing WTO equilibrium. What does that mean to global trade in general and our industry in specific? Mitchell dives into the details.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
Published October 27
I-Connect007 Executive Director Marcy LaRont spent the week in Rosemont, Illinois, attending SMTA International. Read her report on the conference, the expo, and the state of the industry as viewed from a leading industry gathering.
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Simon Khesin - Schmoll MaschinenSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/05/2025 | Marcy LaRont, I-Connect007It’s been another big week in global business news with positive projections on global economic growth, primarily driven by AI. U.S. labor markets are showing some strain after copious layoff activity, and there’s possibly a slight “correction” in the stock market, with investors apparently concerned about corporate overvaluation. My must-reads are interesting, informative, and important for industry members, particularly in the U.S. These selections range from onshoring high-tech thermal control to the value of training, recognizing interconnect defects, and an important statement from the Global Electronics Association regarding the USMCA.
The Government Circuit: USMCA Review—A Crucial Opportunity to Fortify North American Electronics
12/02/2025 | Chris Mitchell -- Column: The Government CircuitAs the 2026 review of the U.S.-Mexico-Canada Agreement (USMCA) approaches, policymakers have a rare opportunity to reinforce a partnership that powers their shared competitiveness, resilience, and growth. That is the message that I will have the honor of delivering on behalf of the Global Electronics Association in a public hearing at the U.S. International Trade Commission in Washington on Dec. 4. We’ve also submitted our views formally to the U.S. Trade Representative, and we’ve shared our position far and wide.
October EMS Trends Show Stabilizing Market and Building Momentum for 2026
11/28/2025 | Global Electronics AssociationThe Global Electronics Association announced the October 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/28/2025 | Nolan Johnson, I-Connect007Yesterday was the U.S. Thanksgiving holiday. The traditional meal is, of course, roast turkey with “all the trimmings.” Although not everyone observes that menu, most do, and it was reported that 42 million turkeys were consumed on that day. With an average weight of 16 pounds per turkey, we cooked up 672 million pounds! With approximately 342 million people in the U.S, that pencils out to just under two pounds of drumstick and white meat per person. That, my friends, is a whole lot of leftovers.
October PCB Shipments Surge 24% as Bookings Soar 41%, Marking Strong Start to Q4
11/26/2025 | Global Electronics AssociationThe Global Electronics Association announced the October 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.00.