-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueFueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
Inner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC Hall of Fame Spotlight Series: Highlighting Gene Weiner
December 31, 2024 | Dan Feinberg, I-Connect007Estimated reading time: 1 minute
Editor’s note: Dan Feinberg continues his series on the IPC Hall of Fame, spotlighting the achievements of past Hall of Fame members.
Over the years, IPC members who have contributed significantly to IPC and our industry have been awarded with the IPC Raymond E. Pritchard Hall of Fame Award. Though many early HOF members have passed away and are unknown to today’s IPC membership, their contributions still resonate. Over the coming months, I look forward to researching and reporting on IPC Hall of Fame members and their contributions. This month, I highlight Gene Weiner.
Gene Weiner is another long-standing member of IPC and an esteemed member of the IPC Hall of Fame. I first worked for Gene when he was the vice president of marketing and sales at Dynachem. Years later, I became president of Dynachem and Gene worked for us as a consultant. Since then, we have worked together on numerous projects over many decades. As a member of IPC since 1962, a complete history of Gene’s efforts and accomplishments over the past 70 years would require writing a full book. So, here I will name just a few of his many contributions to IPC and the greater industry.
Continue reading this article in the December 2024 issue of PCB007 Magazine.
Suggested Items
The Test Connection, Inc. to Showcase Advanced Testing Solutions at SMTA Austin Expo & Tech Forum
02/04/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is excited to announce its participation in the SMTA Austin Expo & Tech Forum on February 6, 2025 in Austin, Texas.
Nolan's Notes: Find the Help You Need—Accessing Technical Resources
02/04/2025 | Nolan Johnson -- Column: Nolan's NotesSome close friends of mine have a card catalog in their family room—with the cards still in it. It’s just a novelty now, but it wasn’t that long ago that the card catalog was the end-all, be-all of research resources. As a college student, I remember something like two dozen or more of the very large card catalog cabinets in the Oregon State University Library. It’s not lost on me that my friend’s card catalog “liberated” from the university is a snapshot of that particular knowledge base at that particular moment in time. Today’s access to a library’s contents have changed dramatically.
Happy’s Tech Talk #37: New Ultra HDI Materials
02/03/2025 | Happy Holden -- Column: Happy’s Tech TalkSome new materials have been introduced in the past year for ultra high density interconnect (UHDI), a convenient title for developing high density technologies. They have received labels like semiconductor-like PCBs (SLPs), redistribution layers (RDL), flip-chip ball grid array (FCBGA), and interposers. The early 2000s saw the creation of these organic substrates for flip-chip IC packaging. The initial construction was composed of a BT core with build-up layers of the Ajinomoto Build-up Film (ABF)
Mind Meld: Brian Chislea and AJ Arriaga Share Their Fascinating Experience in IPC's Mentorship Program
01/28/2025 | Michelle Te, IPC CommunityIPC’s Emerging Engineer program provides professionals an opportunity early in their careers to learn from dedicated industry volunteers participating in standards development. Two participants in the program—Brian Chislea, Dow Chemical, mentor to AJ Arriaga, Summit Interconnect—share their experiences in the program in a series of articles. We will follow them through their three years in the mentorship. This is the first in the series.
The Test Connection, Inc. Launches The Training Connection to Address Critical Test Engineering and Development Needs
01/24/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is excited to announce the launch of its newest venture, The Training Connection, LLC, a company dedicated to addressing the growing need for practical and effective training in test engineering and development. With a focus on critical methodologies such as Design for Test (DFT) and IPC standards, The Training Connection is poised to empower professionals with the tools and expertise they need to excel.