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BOOK EXCERPT: The Printed Circuit Assembler's Guide to... Encapsulating Sustainability for Electronics, Chapter 4
December 31, 2024 | I-Connect007Estimated reading time: 1 minute
The Printed Circuit Assembler's Guide to... Encapsulating Sustainability for Electronics, by Beth Turner, MacDermid Alpha Electronics Solutions
Chapter 4: Sustainability
I like to think that anyone considering using encapsulation resins to ruggedize electronics is contributing in some way towards sustainability targets. The thing all ruggedizing materials have in common is that they work to extend the lifetime and improve performance; surely that ensures fewer defects, fewer recalls and ultimately less waste? When it comes to encapsulation resins, we can do better than that, and the future looks both optimistic and exciting.
Bio-based Supply Chain
Many of the traditional raw material feedstocks for encapsulation resins rely on the use of fossil fuels. Today, there are a plethora of opportunities within this supply chain to source bio-based raw materials. Bio-based materials are completely or partially derived from living organisms, for example crops. As they come from renewable resources, bio-based products can help reduce CO2 emissions and offer other advantages such as lower toxicity. Ultimately, reducing supply chain reliance from fossil fuels towards bio-based renewable feedstocks could be one way of helping to reduce the impact of climate change. It is possible, and easy, to procure bio-based epoxy resins, modifiers, and cure agents. There are a huge number of opportunities to source bio-based polyols, crosslinkers, as well as modifiers. The emergence of bio-based additives for use with these cross-linking chemistries is also on the rise. Companies often use regulated certification systems to ensure sustainability within the supply chain; one example is the ISCC plus certification scheme that aims to prove no deforestation has occurred to produce the biomaterial.
From my experience, there is a general concern that bio-based materials must have some compromise when it comes to performance.
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Single Pair Ethernet (SPE): A Valuable Option for Modern Designs
04/20/2026 | Marcy LaRont, I-Connect007When it comes to designing PCBs and full systems for increasingly complex electronics hardware, who doesn’t want to reduce complexity and cost? Single-Pair Ethernet (SPE) has emerged as a solution and is gaining rapid attention across industrial electronics and PCB design because it enables Ethernet communication over a single twisted pair, replacing the traditional two- or four-pair cabling used in standard Ethernet networks. This seemingly simple shift has significant implications for designers: smaller connectors, reduced cable weight, longer reach, and the ability to carry both data and power over a single pair.
Below the Surface: Looking Ahead to Where Integration Actually Happens
04/20/2026 | Chandra Gupta -- Column: Below the SurfaceProgress in RF rarely arrives and suddenly rewrites the rules. What actually moves performance forward almost always happens in the seams, the interfaces, the choices that determine whether individual parts are allowed to work together, or forced to fight one another. So, when we look ahead in RF systems—from DC through millimeter-wave—the most important conversations aren’t about isolated materials or heroic devices. They’re about integration, and more specifically, about how ceramic-based RF packages and module architectures shape system-level behavior long before the signal ever reaches free space.
The Pivotal Role of AI in Modern Electronics Manufacturing with Koh Young
04/03/2026 | Real Time with... APEX EXPOJoel Scutchfield, of Koh Young America shares how accurate, measurement-based data fuels AI engines for enhanced inspection, auto-programming, and defect classification. Joel emphasizes how self-correction capabilities and data sharing across production lines, driving towards a future of automated, defect-free manufacturing.
Designers Notebook: Heterogeneous Interposer Design Challenge, Part 2
02/16/2026 | Vern Solberg -- Column: Designer's NotebookAs the need grows for higher processing speed and the expanded functionality required for newer generations of central processing units (CPUs), the necessity for higher-density interconnect solutions is paramount. The current trend toward furnishing a single, monolithic system-level semiconductor package has become a serious yield issue in fabrication. For example, with all of the peripheral supporting functions on a single die platform, wafer fabrication yields are often below target and, although the CPU portion of a monolithic semiconductor may be perfect, if one or more of the supporting functions on the same die fails, the entire processor unit must be discarded.
Ukraine expands partnership with ICEYE
01/20/2026 | ICEYEICEYE, the leader in European defense tech and Synthetic Aperture Radar (SAR) satellite operations, and a customer within the Ministry of Defence of Ukraine have signed a new agreement to significantly expand their cooperation in space-based intelligence.