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Spirox Launches High-Speed TGV Crack Inspection System to Support High-Volume Glass Substrate Inspection

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Spirox, hosted the Advanced Packaging Technology Forum, bringing together experts from Corning and DNP to share insights on Glass Core, TGV, reliability, and inspection technologies for next-generation AI and HPC applications.

Closing the Gap: Measuring 20-µm Spacing in Advanced SiP Packaging

09/18/2026 | Axel Lindloff, Koh Young Europe
Twenty microns does not leave much room for error. As advanced packaging increases functional density, the distance between neighboring devices is shrinking to dimensions that create an entirely new set of inspection challenges. In some system-in-package (SiP) applications, components approximately 200 to 300 µm tall can be separated by gaps of only 20 to 30 µm. Measuring those spaces accurately requires considerably more than simply increasing camera magnification. The challenge is optical access.

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When the industry meets at Bondexpo in Stuttgart from 6 to 8 October 2026, Rehm Thermal Systems will also be presenting innovative equipment solutions for precise dispensing, potting and curing processes. In hall 6 at  booth 6505, the company will showcase the ProtectoXC and the RDS UV LED – two powerful systems designed for flexible, efficient and reproducible production processes.

Koh Young Brings Advanced Packaging Inspection and Metrology Solutions to SEMICON West 2026

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