-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Peters Leverages Inkjet Technology to Optimize PCB Manufacturing
January 17, 2025 | PetersEstimated reading time: 2 minutes

Peters has put the second SUSS LP50 ‘Pixdro’ inkjet printer into operation. This machine enables the application of solder resist in digital additive technology by means of the inkjet process, thus providing Peters Research, in this relatively new segment, with more possibilities in research and process technology, in addition to the conventional coating processes (screen printing, curtain coating and spray coating).
By means of this second inkjet printer, the R&D department of the ink manufacturer from the Lower Rhine is able to simulate projects from industrial customers in their own laboratories, push forward the qualification process and make reliable recommendations. “Its print head is the same, so a laboratory project will also work on industrial printers equipped with several print heads of this type,” says Kevin Poth, ELPEPCB® Project Manager at Peters, describing the benefit of a purchase.
“Thanks to the precise positioning and small droplet volumes, inkjet printing is suitable for a variety of applications, such as printed electronics, printed circuit boards or semi-conductor assembly,” explains service engineer Leon van Lieshout from the Eindhoven-based manufacturer SUSS MicroTec. Among the main features of the Pixdro there is robustness, process control, user-friendliness and precision, says the Dutchman who has just set up the printer at Peters with a team of three engineers.
Electrical properties optimized
The bottom line is that with the solder resist for digital inkjet printing, Peters is highlighting its decades of expertise as a supplier of high-quality electronic coatings, and is now continuing to focus on this new card. By means of the Samba Dimatix print head, the ink is sprayed in the same way as with an inkjet printer and selectively applied to the circuit board. Besides protecting against corrosion and mechanical damage, the solder resist optimises the electrical properties of the PCB. The solder resist has already withstood solder processes without any problems and has therefore already fulfilled its first essential service.
Inkjet printers and the ELPEPCB® solder resists from the Elpejet® IJ 2467 series enable new PCB layouts and interesting resist geometries. By the so-called “digital drop-on-demand” technology, the solder resist is applied selectively. Compared to conventional application methods such as screen printing, spray coating or curtain coating in conjunction with exposure and development steps, the process is simplified and accelerated, which reduces the material consumption significantly.
Project manager Kevin Poth (left) with technical staff from the Dutch subsidiary SUSS MicroTec that developed the SUSS LP50 ‘Pixdro’ printer for research purposes and is now setting it up in the Peters lab (from the right): Application engineer IoannisKawadias, system engineer Maria Tracz, service engineer Leon van Lieshout.
Photos: Peters/Axel Küppers
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Dr. Jennie Hwang to Present on ‘Solder Joint Reliability’ at SMTA International 2025
09/03/2025 | Dr. Jennie HwangDr. Jennie Hwang to address “Solder Joint Reliability” at the 2025 SMTA International Conference on Monday, October 20. Leveraging her decades of extensive real-world experiences and deep knowledge,
Indium to Highlight Energy-Efficient, High-Reliability Solder Solutions for EV and Electronics at Productronica India
09/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at Productronica India, to be held September 17-19 in Bengaluru, India.
Altus Supports Datalink Electronics with Advanced Selective Soldering Solution to Boost Manufacturing Efficiency
09/02/2025 | Altus GroupDatalink Electronics has partnered with Altus Group to integrate a cutting-edge automated soldering solution, enhancing its production capabilities and reinforcing its strategic focus on quality, automation, and scalability.
Connect the Dots: How to Avoid Five Common Causes of Board Failure
09/03/2025 | Matt Stevenson -- Column: Connect the DotsBoards fail for various reasons, and because I’ve been part of the PCB industry for a long time, I’ve seen most of the reasons for failure. As part of my ongoing crusade to help designers design for the reality of manufacturing, here are five common causes for board failure and how to avoid them.
More Than a Competition: Instilling a Champion's Skill in IPC Masters China 2025
09/01/2025 | Evelyn Cui, Global Electronics Association—East AsiaNearly 500 elite professionals from the electronics industry, representing 18 provinces and municipalities across China, competed in the 2025 IPC Masters Competition China, March 26–28, in Pudong, Shanghai. A total of 114 contestants advanced to the practical competition after passing the IPC Standards Knowledge Competition. Sixty people competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 24 in the Ball Grid Array/Bottom Termination Components (BGA/BTC) Rework Competition.