ASMPT Presents High-performance LED Die Bonder

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ASMPT, the world's leading supplier of hardware and software for semiconductor and electronics manufacturing, presents Vortex II, a high-performance die bonder for the production of mini LED displays, such as those used in the automotive industry.

“High-resolution, ergonomic LED displays in modern cars ensure drivers have all important and safety-relevant information in view at all times,” explains Jonathan Ku, Senior Director of Business Development at ASMPT. “This is where very small LEDs are used, which have to be assembled highly precisely and reliably – because customers from the automotive industry do not accept reworked products. It is exactly for such demanding tasks that we designed and developed Vortex II.”

Innovative bond head

The highly innovative die bonder can process Mini LEDs with a minimum size of 2 mil × 4 mil (50 µm × 100 µm), for example for direct view RGB LED displays with ultra-fine pitch. The machine uses a newly developed bond head with automatic delay-free XYθ correction. The precision of XY placement can achieve ± 10 µm @ 3σ, with a die rotation of ± 1° @ 3σ.

Highly effective bin mixing

Process stability and high one-pass rates, even at maximum throughput, are guaranteed by an automatic correction function combined with ASMPT's patented bond head technology. The light-up yield is up to 99.999 percent. Thanks to fully automatic RGB wafer handling, this enables one-stop production and highly effective bin mixing and therefore uniform screen colors.

Vortex II is also 'ready for Industry 4.0 system architectures' through automation with ASMPT's In-Line Linker System, which enables efficient material handling, a specialized system that allows seamless integration of high-precision bonding systems into automated manufacturing processes."