Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
Summit Interconnect Welcomes Leo LaCroix as Vice President of Aerospace & Defense Operations
February 21, 2025 | Summit Interconnect, Inc.Estimated reading time: 1 minute
Summit Interconnect, a leading provider of advanced printed circuit board (PCB) solutions, is pleased to announce that Leo LaCroix has joined the company as Vice President of Aerospace & Defense Operations. In this role, LaCroix will oversee operational strategy, customer engagement, and manufacturing excellence for Summit’s aerospace and defense-focused facilities, driving continued growth and innovation in the sector.
LaCroix brings more than 25 years of leadership experience in complex manufacturing environments, with deep expertise in PCB technologies, operations management, and supply chain optimization. He has successfully led multi-facility teams across North America and Asia, spearheading initiatives in lean manufacturing, process improvement, and advanced technology development.
“Leo’s extensive experience in PCB manufacturing, coupled with his proven ability to drive operational excellence, makes him a tremendous addition to the leadership team at Summit Interconnect,” said Shane Whiteside, CEO of Summit Interconnect. “As we continue to strengthen our partnerships within the A&D industry, his leadership will be instrumental in enhancing our capabilities and delivering outstanding value to our customers.”
Prior to joining Summit Interconnect, LaCroix served as Executive Vice President of the Circuits Division at Firan Technology Group, where he was instrumental in integrating and optimizing the company’s U.S.-based facilities. His leadership resulted in significant revenue growth, operational efficiencies, and strategic positioning within the aerospace and defense sector. He also held senior leadership roles at Sanmina Corporation and Viasystems, where he was instrumental in driving profitability, securing major defense contracts, and advancing PCB manufacturing capabilities.
LaCroix expressed his enthusiasm for joining Summit Interconnect, stating: “I am excited to be part of a company that is committed to innovation and excellence in PCB manufacturing. Summit Interconnect has a strong reputation for best-in-class solutions, and I look forward to working with this outstanding team to drive continuous process improvements, expand our technological capabilities, and exceed our customers’ expectations.”
LaCroix holds a Bachelor’s degree in International Economy and Policy Studies from the University of Wisconsin–Madison with a concentration in International Business and multiple professional certifications in supply and operations management, including a Lean Six Sigma Black Belt.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer
09/09/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading North American manufacturer of Printed Circuit Boards (PCBs), today announced that Leo LaCroix has assumed the role of Chief Operating Officer (COO).
Summit Interconnect Names Milan Shah as Vice Chairman of the Board
08/26/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading provider of advanced PCB manufacturing, today announced that Milan Shah has been named Vice Chairman of the Board.
Beyond Recycling: Reshaping Sustainability in Electronics
07/24/2025 | Marcy LaRont, PCB007 MagazineEnvironmental sustainability, especially for carbon-intensive industries like electronics manufacturing, means businesses are often plagued with various reporting requirements that don’t necessarily address the root problem. To that end, SERI and the Global Electronics Association are teaming up to reshape sustainability in electronics.
AI-driven MES Rewriting the Rules of Manufacturing Transformation
07/23/2025 | Francisco Almada Lobo, Critical ManufacturingThe Critical Manufacturing MES & Industry 4.0 International Summit, June 12–13, revealed a profound shift in how manufacturers approach digital transformation. AI-enabled execution systems are no longer a future ambition but are essential for navigating complexity and driving change.
Summit Interconnect Participates in PCBAA Annual Meeting to Advance U.S. Electronics Policy
06/26/2025 | Summit Interconnect, Inc.Summit Interconnect was proud to participate in the 2025 Annual Meeting of the Printed Circuit Board Association of America (PCBAA), held in Washington, D.C. this June.