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Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
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Experience Full Coverage Inspection at Global Industrie 2025
March 3, 2025 | TRIEstimated reading time: Less than a minute

Davum-TMC, TRI's distributor, will participate in Global Industrie 2025. Visit Booth #6G87 at Eurexpo Lyon, France, from March 11 to 14, 2025.
Davum will showcase TRI's Smart Multi-Camera 3D AOI TR7500QE Plus. The 3D AOI offers high-performance 3D solder and assembly inspection by combining the next-generation multi-angle 2D and 3D technologies based on 4-way adaptive digital fringe pattern projection and 4 side view cameras.
The AI-powered solutions from TRI include the AI training tool, the AI Station, Verify Host, AI Smart Programming, and more. TRI solutions comply with the latest Smart Factory standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
Discover why the largest EMS businesses chose TRI as their Test and Inspection Partner at Davum-TMC's booth #6G87 at Global Industrie 2025.
Suggested Items
2024 Global Semiconductor Materials Market Posts $67.5 Billion in Revenue
04/29/2025 | SEMIGlobal semiconductor materials market revenue increased 3.8% to $67.5 billion in 2024, SEMI, the global industry association representing the electronics design and manufacturing supply chain, reported in its Materials Market Data Subscription (MMDS).
New RF Materials Offer Options for RF Designers
04/29/2025 | Andy Shaughnessy, Design007 MagazineThe RF materials arena has changed quite a bit in the past decade. The newest thermoset laminates boast performance numbers that are almost competitive with PTFE, but without the manufacturability challenges. At IPC APEX EXPO this year, I spoke with Brent Mayfield, business development manager at AGC Multi Material America. Brent walked through some recent innovations in RF materials, advances in resin systems, and the many design trade-offs for RF engineers to consider for each material set.
Real Time with... IPC APEX EXPO 2025: Winner of the IPC Best Student Poster Award
04/29/2025 | Real Time with...IPC APEX EXPOSebastian Carrillo, winner of the Best Student Technical Poster Award, shares insights on his research in nanotechnology and plasmonics. His work on a metal insulator nano array focuses on light-matter interactions at the nanoscale. With advancements in manufacturing, applications include sensing technologies and photovoltaic systems. Sebastian discusses his project involving simulations and optical experiments. His career goals are in research, and he encourages students to seize academic opportunities.
New IPC Standard Sets First Global Benchmark for E-Textile Wearable Reliability
04/29/2025 | IPCIPC announces the release of IPC-8981, Quality and Reliability of E-Textile Wearables. This first-of-its-kind standard sets baselines for testing and classifying e-textile wearables, addressing key challenges in product reliability, performance, and quality assurance.
Rising Star Award: Paavo Niskala, TactoTek
04/28/2025 | Nolan Johnson, I-Connect007Paavo Niskala joined the IPC community in 2022 as part of the inaugural steering group for in-mold electronics. He led the development of standard IPC-8401, Guidelines for In-Mold Electronics, chairing the project from its inception to its publication in 2024. Currently, Paavo serves as vice chair of the D-84A Plastronics Accelerated Reliability Testing Task Group, contributing his expertise to advancing reliability standards in the field.