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New IPC Standard Sets First Global Benchmark for E-Textile Wearable Reliability
April 29, 2025 | IPCEstimated reading time: 1 minute
IPC announces the release of IPC-8981, Quality and Reliability of E-Textile Wearables. This first-of-its-kind standard sets baselines for testing and classifying e-textile wearables, addressing key challenges in product reliability, performance, and quality assurance. IPC-8981 introduces a common framework for evaluating wearables that integrate electronics directly into textile materials—applications that span healthcare, defense, fitness, and consumer technology.
The standard was developed by the IPC E-Textiles Wearables Standard Task Group, led by Vladan Koncar of ENSAIT GEMTEX Lab – University of Lille and Sigrid Rotzler of Fraunhofer-Institut fur Zuverlassigkeit und Mikrointegration. The task group included international experts from both the textile and electronics industries, bringing multidisciplinary insight to the testing needs of e-textile wearables.
“As the first standard of this kind, IPC-8981 provides a solid basis for e-textile developers to make their products more reliable, set quality targets, and choose relevant testing methods,” Rotzler explained.
Added Koncar, “Our IPC-8981 standard and the associated test methods are essential: They help companies from both the textile and electronics sectors collaborate more effectively to develop high-quality products that are ready for market adoption.”
IPC-8981 is supported by 14 newly published IPC-TM-650 Test Methods covering environmental and mechanical durability factors such as abrasion, perspiration, UV exposure, and washing. It also offers guidance on part classification, testing thresholds, and how to reduce unnecessary testing steps to streamline development.
The release of IPC-8981 marks a pivotal step forward for the e-textiles wearables industry—providing the tools needed to transform wearable electronics from promising prototypes into reliable, market-ready solutions.
To purchase IPC-8981, visit the IPC Store. To learn more to join the IPC E-Textiles Wearables Standard Task Group and guide future enhancements to the standard, visit IPC's committee page.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
ViaSat-3 F3 Satellite Successfully Launches from Kennedy Space Center
05/04/2026 | BoeingBoeing mission controllers confirmed that the ViaSat-3 F3 (VS-3 F3) satellite is healthy in orbit following its successful launch aboard a SpaceX Falcon Heavy rocket at 10:13 a.m. ET from Kennedy Space Center (KSC) in Florida.
Microchip Expands Post-Quantum Root of Trust Controllers
04/29/2026 | MicrochipAs the industry embarks on the transition to post‑quantum cryptography (PQC), Microchip Technology is expanding its portfolio of Trust Shield, PQC‑ready devices with the TS1800 Platform Root of Trust controller and the TS50x secure boot controller.
Is China Plus One Still Happening in the PCB Industry?
04/28/2026 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.For much of the past five years, China Plus One has been shorthand for supply-chain diversification: reducing dependency on mainland China by adding manufacturing capacity elsewhere in Asia. In the PCB industry, however, in early 2026, it is more nuanced. It looks less like a clean geographic shift and more like a layered, capital-intensive rebalancing of global capacity, one that still leaves China deeply embedded at the center.