SMT Perspectives and Prospects: Artificial Intelligence, Part 5: Brain, Mind, Intelligence
Global Sourcing Spotlight: Watch Out! Avoiding Pitfalls in Global Sourcing
Nolan’s Notes: Looking Deep Into the Future With X-ray
Indium Experts to Present on Solder and Thermal Solutions at APEX 2025
March 7, 2025 | Indium CorporationEstimated reading time: 1 minute
As a global supplier of solder and thermal interface material (TIM) products, Indium Corporation experts are proud to share their technical insight and knowledge on a variety of industry-related topics at IPC APEX Expo, March 18-20 in Anaheim, California.
Tuesday, March 18
Achieving Lower Voids with a Novel Preform Flux Technology, presented by Research Chemist David Bedner, and co-authored by Lee Kresge, Igor Faleichik, Dan McElhinney, and Dr. Ricky McDonough.
- This presentation introduces a next-generation preform flux that significantly reduces voiding in solder joints, enhancing thermal performance and reliability across various applications, with testing demonstrating up to a 67% reduction in voids under optimized reflow conditions.
Wednesday, March 19
Enhancing PCB Reliability: Voiding Reduction Design with a Mixed-Alloy Solder, presented by Technical Support Engineer Thuy Nguyen, and co-authored by Dr. Hongwen Zhang, Dr. Ronald C. Lasky, and Adam Murling.
- This presentation explores the development of novel mixed-alloy solder paste Durafuse® HR, which reduces voiding while maintaining high-reliability thermal cycling performance, offering improved solutions for automotive, high-performance computing, and 5G communication applications.
Novel Supercooled Solder Materials for Lower-Than-Liquidus Reflow presented by R&D Manager Dr. Ian Tevis, co-authored by Dr. Yifan Wu and Radhika Jadhav.
- This presentation showcases the development of supercooled solder pastes using core-shell bismuth-tin (BiSn) particles, enabling reliable solder interconnects at temperatures 40°C lower than conventional reflow profiles, making them ideal for future electronics manufacturing and temperature-sensitive applications.
Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing – Part II, co-presented by Senior Product Specialist Miloš Lazić and Sunny Agarwal, ITW EAE. Co-authored by Dr. Ricky McDonough.
- This presentation examines the advancements in liquid metal paste (LMP) technology, showcasing its enhanced thermal conductivity and adaptability for high-performance computing applications, while addressing challenges associated with traditional liquid metal thermal interface materials (TIMs).
Phase-Change Metal (PCM) TIMs for Enhanced Thermal Management – Part II, presented by Miloš Lazić, co-authored by Dr. Ricky McDonough and Bob Jarrett.
- This presentation introduces newly developed gallium-based and gallium-free phase-change metal (PCM) TIMs, designed to remain in a liquid state at operating temperature, delivering exceptionally low thermal resistance. Power cycling and HAST data highlight their robust performance and underscore the necessity of containment strategies, while gallium-free solutions enable compatibility with aluminum heat-sinks.
Share on:
Suggested Items
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.
BEST Inc to Host Soldering 101 Workshop at Illinois & Michigan Locations
04/15/2025 | BEST Inc.BEST Inc., a leader in electronic component services, training, and products is pleased to announce it will host multiple Soldering 101 workshops in its Rolling Meadows, Illinois and Lansing, Michigan locations.
Real Time with... IPC APEX EXPO 2025: Advancements in Inkjet Technology With Electra Polymers
04/14/2025 | Real Time with...IPC APEX EXPODon Monn from Electra Polymers discusses the evolution of inkjet technology since 2016, focusing on market changes and the reliability of inkjet products. He explains the additive inkjet process, which reduces waste and boosts efficiency. The conversation highlights Electra Polymers' strong market presence in North America and the importance of customer trust.
Saki’s AXI Upgrade Enhances Image Noise Reduction for Power Modules, Enabling Sharper, More Accurate Inspections
04/11/2025 | Saki CorporationSaki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, announces significant enhancements to the image processing capabilities of its 3Xi-M200 X-ray Automated Inspection (AXI) system.
Electra's ElectraJet EMJ110G Powers Seamless Transition at Sunrise Electronics
04/11/2025 | Electra Polymers LtdElectra, in partnership with Allen Woods Associates, is proud to announce the successful deployment of its ElectraJet® EMJ110G Soldermask on KLA’s Orbotech Neos™ platform, now running production at Sunrise Electronics in Elk Grove Village, Illinois.